Senior SI/PI Packaging Lead for High-Speed ASICs

Cisco

Denver (CO)

Remote

USD 170,000 - 210,000

Full time

5 hours ago
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Job summary

Cisco Silicon One, based in the United States, seeks a Signal and Power Integrity Technical Lead to drive next-generation ASIC packaging. You will define design rules, analyze SI/PI, and collaborate with interposer, substrate, and PCB teams to deliver high-quality packaging for Cisco platforms.

Lead reviews, mentor engineers, and promote postmortems and continuous improvement across multi-disciplinary teams while ensuring performance, reliability, and manufacturability.

Qualifications

  • Bachelor's degree in Electrical Engineering with 8+ years SI/PI experience, or higher degrees with equivalent experience.
  • Experience with 56G PAM4 SerDes, channel modeling, BER prediction.
  • Proficiency with pre- and post-layout SI/PI simulations using Cadence Sigrity, Ansys HFSS, and Keysight ADS.

Responsibilities

  • Develop and verify high-speed ASIC packages ensuring SI/PI performance across interposer, substrate, and PCB.
  • Lead design rule development for ultra-high-speed signaling while meeting power, performance, and area goals.
  • Mentor junior engineers and coordinate with layout, packaging, and system teams to resolve complex issues.
  • Define processes and tools for complex ASIC/package developments and participate in architecture discussions.

Skills

High-Speed Design
SI/PI Simulations
Layout Review
SPICE Analysis

Education

Bachelor of Electrical Engineering
Master of Electrical Engineering
PhD in Electrical Engineering

Tools

Cadence Sigrity
Ansys HFSS
Keysight ADS
Cadence APD
Ansys EM

Job description

Cisco Silicon One, based in the United States, seeks a Signal and Power Integrity Technical Lead to drive next-generation ASIC packaging. You will define design rules, analyze SI/PI, and collaborate with interposer, substrate, and PCB teams to deliver high-quality packaging for Cisco platforms.

Lead reviews, mentor engineers, and promote postmortems and continuous improvement across multi-disciplinary teams while ensuring performance, reliability, and manufacturability.

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