Senior SI/PI Engineer - 2.5D/3D Packaging for AI Centers

Amazon; Cupertino (CA); On-site; USD 213,000 - 288,000; Full time

Job summary

Annapurna Labs in Cupertino, CA, part of Amazon, is seeking a Sr. Signal & Power Integrity Engineer to own the package‑level SI/PI strategy for 2.5D/3D‑IC packaging and next‑gen ML/data center ASICs.

You will lead SI/PI analyses, optimize stack‑ups, run high‑speed simulations, model decoupling and PDN, and collaborate with ASIC, board and packaging teams to ensure electrical performance meets manufacturing targets.

Qualifications

• Bachelor’s degree in Electrical Engineering or related field.
• 10+ years in signal integrity, power integrity, and package design.
• Deep expertise in package SI/PI analysis and PDN impedance.
• Hands-on with EM simulation and SI/PI tools.

Responsibilities

• Lead package-level SI/PI analysis for 2.5D, 3D-IC, fan‑out architectures.
• Design and optimize package stack-ups and impedance control.
• Perform high-speed channel simulations for die-to-die and die-to-board.
• Model and optimize PDN from die bumps to board.
• Characterize on-die capacitance and IPD capacitors within PDN.
• Collaborate with ASIC, board, and packaging teams on electrical performance.
• Develop SI/PI modeling flows and automation scripts.

Skills

SI/PI Analysis

EM Simulation

Package Design

Lab Measurements

2.5D/3D-IC

Education

Bachelor's in Electrical Engineering

Master's degree

Tools

HFSS

Cadence Sigrity

ADS

LabVIEW/Custom tools

Job description

Annapurna Labs in Cupertino, CA, part of Amazon, is seeking a Sr. Signal & Power Integrity Engineer to own the package‑level SI/PI strategy for 2.5D/3D‑IC packaging and next‑gen ML/data center ASICs.

You will lead SI/PI analyses, optimize stack‑ups, run high‑speed simulations, model decoupling and PDN, and collaborate with ASIC, board and packaging teams to ensure electrical performance meets manufacturing targets.