Senior ASIC SI/PI Engineer for AI‑Native Packaging

OpenAI; San Francisco (CA); On-site; USD 180,000 - 240,000; Full time

Job summary

OpenAI's Hardware organization is seeking an experienced ASIC Package Signal Integrity / Power Integrity Engineer to drive electrical architecture, modeling, optimization, and validation for AI/HPC silicon and package design.

You will own SI/PI architecture for high-speed channels and 2D/3D EM modeling, collaborating across ASIC, package, PCB, system, mechanical, and thermal teams from feasibility to production.

Qualifications

• 5+ years in signal and power integrity, high-speed interconnect, PDN and package design.
• Strong grasp of transmission-line behavior, impedance, loss, crosstalk and return paths.
• Hands-on with EM/SI tools: HSPICE, HFSS‑PI, SIwave, Ansys.
• Experience with Cadence APD/SIP package layouts.
• Experience creating automated design optimization for model extraction.
• Excellent cross-functional collaboration with ASIC, package, PCB, and mechanical teams.

Responsibilities

• Own SI/PI architecture and analysis for advanced AI ASIC packages from feasibility to production.
• Develop and optimize high-speed channels for 200G/400G SerDes, PCIe, HBM, DDR, and chiplet interfaces.
• Model package, interposer and substrates using 2D/3D EM tools.
• Define stack-ups, transmission lines, vias, return paths, shielding, and ball maps per SI/PI needs.
• Develop channel loss, crosstalk, impedance, skew, return-loss and link-budget requirements.
• Perform package-level PDN analysis: impedance, loop inductance, DV/droop, decoupling, current distribution.
• Drive die/package co-design including bump/BGA, power/ground allocation and high-speed I/O placement.
• Develop automation flows for early architecture exploration and SI/PI sign-off.

Skills

Signal integrity

Power integrity

High-speed interconnect design

PDN design

Package electrical design

Transmission-line behavior

Impedance

Crosstalk

Return paths

Electromagnetic simulation

Automated design optimization

Cross-functional collaboration

Tools

Synopsys HSPICE

Ansys HFSS‑PI

SIwave

Cadence Clarity

Sigrity PowerSI/PowerDC

Cadence APD/SIP

Job description

OpenAI's Hardware organization is seeking an experienced ASIC Package Signal Integrity / Power Integrity Engineer to drive electrical architecture, modeling, optimization, and validation for AI/HPC silicon and package design.

You will own SI/PI architecture for high-speed channels and 2D/3D EM modeling, collaborating across ASIC, package, PCB, system, mechanical, and thermal teams from feasibility to production.