Advanced Packaging SI/PI Engineer

Amazon Inc.; Omaha, Northern (NE, KY); Hybrid; USD 154,000 - 247,000; Full time

Job summary

Amazon Inc. is seeking a Signal & Power Integrity Engineer for Annapurna Labs to advance SI/PI analyses for 2.5D/3D-IC packaging in next-gen data center ASICs.

In this role, you will support the package-level SI/PI effort with simulations, modeling, and design input across IC, package, and board boundaries. You will work closely with senior engineers to ensure performance targets and manufacturing requirements are met, contributing to robust power delivery and signal integrity in high-speed

Qualifications

• Bachelor's degree in Electrical Engineering or related field.
• 5+ years of experience in signal integrity, power integrity, or package design.
• Proficiency with SI/PI tools and EM simulation.
• Understanding of packaging technologies: 2.5D/3D-IC, interposers.

Responsibilities

• Perform package-level SI or PI simulations for 2.5D, 3D-IC, fan-out, and interposers.
• Support package stack-up design; impedance control analysis and layer assignment.
• Run high-speed channel simulations and analyze PDN performance.
• Model advanced interconnects like microbumps and TSVs for SI/PI.
• Build and validate decoupling models for on-die capacitors and IPD devices.
• Coordinate with SoC and board teams for requirements and co-optimization.
• Flag potential manufacturing risks and propose mitigations.

Skills

Strong communication skills

Team collaboration

Analytical thinking

Education

Bachelor's degree in Electrical Engineering

Master's degree in Electrical Engineering

Tools

HFSS

Cadence Sigrity PowerSI

Cadence Sigrity PowerDC

Clarity

ADS

Job description

Amazon Inc. is seeking a Signal & Power Integrity Engineer for Annapurna Labs to advance SI/PI analyses for 2.5D/3D-IC packaging in next-gen data center ASICs.

In this role, you will support the package-level SI/PI effort with simulations, modeling, and design input across IC, package, and board boundaries. You will work closely with senior engineers to ensure performance targets and manufacturing requirements are met, contributing to robust power delivery and signal integrity in high-speed