Senior SI/PI Engineer — 2.5D/3D Packaging (AI Silicon)

Amazon; Austin (TX); On-site; USD 159,000 - 215,000; Full time

Job summary

Annapurna Labs, an organization within Amazon, seeks a Sr. Signal & Power Integrity Engineer to lead package SI/PI analysis for next‑gen 2.5D/3D packaging in cloud AI hardware. Own the package‑level strategy and drive design closure through measurements and modeling.

Role emphasizes PDN impedance, decoupling, EMIR, and high‑speed interconnects with hands‑on experience using HFSS, Sigrity, and Cadence tools, delivering scalable, manufacturable packaging solutions.

Qualifications

• Bachelor's degree in Electrical Engineering or related field.
• 10+ years of experience in signal integrity, power integrity, and package design.
• Experience with SI/PI analysis: S-parameter extraction, PDN impedance analysis, IR drop, crosstalk, and return loss.
• Hands‑on experience with EM simulation tools and lab measurements (HFSS, Cadence Sigrity, ADS).

Responsibilities

• Lead package-level SI/PI analysis for 2.5D, 3D-IC, fan‑out, and silicon interposer/bridge architectures.
• Design and optimize package stack‑ups with impedance control and RDL routing for high‑speed performance.
• Perform high‑speed simulations (S-parameter, time-domain) for die‑to‑die and die‑to‑board interfaces.
• Analyze and optimize the package PDN end‑to‑end including IR drop and AC impedance.
• Characterize and model on‑die capacitance, DTCs, and IPD capacitors within PDN.
• Interface with SoC die‑level PDN teams to align power grid requirements and decoupling budgets.
• EMIR analysis using 3D/2.5D tools to validate IR drop across multi‑die stacks.
• Model microbumps, TSVs, RDL traces for signal and power paths.
• Apply equalization and evaluate channel margins for PCIe/UCIe links.
• Perform clock distribution and jitter analysis at the package level.
• Collaborate with ASIC/board/packaging teams to co‑optimize architecture for yield.
• Identify and mitigate manufacturing risks affecting SI/PI.
• Develop and maintain package SI/PI modeling flows and design guidelines.

Skills

Signal integrity

Power integrity

EM simulation

S-parameter extraction

PDN analysis

Cross-functional collaboration

Lab measurements

Education

Bachelor's degree in Electrical Engineering

Master's degree in Electrical Engineering

Tools

HFSS

Cadence Sigrity

ADS

2.5D/3D-IC familiarity

Job description

Annapurna Labs, an organization within Amazon, seeks a Sr. Signal & Power Integrity Engineer to lead package SI/PI analysis for next‑gen 2.5D/3D packaging in cloud AI hardware. Own the package‑level strategy and drive design closure through measurements and modeling.

Role emphasizes PDN impedance, decoupling, EMIR, and high‑speed interconnects with hands‑on experience using HFSS, Sigrity, and Cadence tools, delivering scalable, manufacturable packaging solutions.