Senior Process Development Lead, Advanced Packaging

1000 Micron Technology, Inc.; Boise (ID); On-site; USD 180,000 - 240,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time‑off

Paid holidays

Job summary

Micron Technology, Inc. in Boise, Idaho, is seeking an experienced organizational leader to drive methodology improvements and apply AI/advanced analytics to accelerate development of its most advanced memory packaging technologies, including HBM and 3DS DRAM.

You will influence internal roadmaps, partner with R&D, suppliers, and manufacturing across programs, guiding end‑to‑end execution and multi‑domain decisions.

Qualifications

• MS in Chemistry, Chemical Engineering, Materials Science, or related field (or equivalent experience).
• Strong understanding of semiconductor process integration and materials interactions.
• Proven experience leading complex cross‑functional technical programs.

Responsibilities

• Own advanced packaging process technologies across wafer‑level and die‑level modules from pathfinding through manufacturing readiness.
• Develop and mature novel process flows, materials, and integration schemes that meet electrical, mechanical, thermal, cost, and reliability needs.
• Lead FOAK development, supplier engagement, and ecosystem collaboration to close capability gaps and accelerate learning.
• Drive structured problem solving for multi‑domain technical challenges and guide strategic decisions across programs.
• Lead technology transfer to manufacturing and influence packaging and integration decisions across product teams.

Skills

Cross-functional leadership

Data-driven decision making

Education

MS in Chemistry/Chemical Engineering/Materials Science

Job description

Micron Technology, Inc. in Boise, Idaho, is seeking an experienced organizational leader to drive methodology improvements and apply AI/advanced analytics to accelerate development of its most advanced memory packaging technologies, including HBM and 3DS DRAM.

You will influence internal roadmaps, partner with R&D, suppliers, and manufacturing across programs, guiding end‑to‑end execution and multi‑domain decisions.