DMTS Process Development Engineer — AI-Enabled Packaging

Micron Technology, Inc; Boise (ID); On-site; USD 140,000 - 210,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time off

Paid holidays

Benefits that protect income

Job summary

Micron Technology, Inc. is seeking an experienced organizational leader to guide methodology improvements, data-driven decision-making, and AI/advanced analytics to drive innovation in advanced packaging for memory products.

You will steer end-to-end technology execution across HBM, 3DS DRAM, and emerging 3D architectures, influencing internal roadmaps and external ecosystems. You will lead cross-functional programs, mentor engineers, and collaborate across teams to deliver high-impact packaging

Qualifications

• MS in Chemistry, Chemical Engineering, Materials Science, or related field (or equivalent experience).
• 15+ years in semiconductor process development, manufacturing, or advanced packaging.
• Deep expertise in wafer-level or die-level processes such as CMP, etch, cleans, thin films, lithography, hybrid bonding, TCB, dicing, or molding.
• Strong understanding of semiconductor process integration and materials interactions.
• Proven experience leading complex cross-functional technical programs.

Responsibilities

• Own advanced packaging process technologies across wafer-level and die-level modules from pathfinding through manufacturing readiness.
• Develop and mature novel process flows, materials, and integration schemes that meet electrical, mechanical, thermal, cost, and reliability needs.
• Lead FOAK development, supplier engagement, and ecosystem collaboration to close capability gaps and accelerate learning.
• Drive structured problem solving for multi-domain technical challenges and guide strategic decisions across programs.
• Lead technology transfer to manufacturing and influence packaging and integration decisions across product teams.
• Leverage AI-enabled tools, automation, data analytics, and advanced modeling methods to accelerate process development and improve outcomes across advanced packaging programs.

Skills

Leadership

Data-driven decision-making

AI/advanced analytics

Problem solving

Education

MS in Chemistry, Chemical Engineering, Materials Science, or related field

PhD in a relevant technical field

Tools

AI-enabled tools

Automation

Advanced modeling

Job description

Micron Technology, Inc. is seeking an experienced organizational leader to guide methodology improvements, data-driven decision-making, and AI/advanced analytics to drive innovation in advanced packaging for memory products.

You will steer end-to-end technology execution across HBM, 3DS DRAM, and emerging 3D architectures, influencing internal roadmaps and external ecosystems. You will lead cross-functional programs, mentor engineers, and collaborate across teams to deliver high-impact packaging