Senior Principal Engineer – Advanced Packaging Innovation

Micron Technology, Inc; Boise (ID); On-site; USD 150,000 - 210,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time off

Paid holidays

Relocation support (if applicable)

Job summary

Micron Technology, Inc. Boise campus seeks a Principal Engineer to guide advanced packaging technology roadmaps and investment priorities. You will apply rigorous cost and value analysis to balance performance, scalability, and total cost of ownership.

This role requires deep technical leadership, cross-functional collaboration, and influence at senior management levels to drive revenue and strategic success.

Qualifications

• Over 10 years in semiconductor advanced packaging.
• BS/MS/PhD in Materials Science, Electrical/Mechanical/Physics or related field.
• Deep knowledge of 2.5D and 3D integration strategies including hybrid bonding.
• Hands-on process module engineering in WLP or 3D stacking.

Responsibilities

• Deliver high-value technology solutions and drive innovation for business value.
• Collaborate with internal and external partners for seamless integration.
• Consult and influence senior management decisions with technical data.
• Analyze competitive trends to strengthen Micron’s edge.
• Guide packaging roadmaps and assess data-driven requirements.
• Innovate through patents and publications to build wins.

Skills

Strategic leadership

Cross-functional collaboration

Data-driven decision making

Innovation mindset

Education

Advanced packaging degree required

Tools

Wafer Level Packaging

3D integration

Hybrid bonding

Job description

Micron Technology, Inc. Boise campus seeks a Principal Engineer to guide advanced packaging technology roadmaps and investment priorities. You will apply rigorous cost and value analysis to balance performance, scalability, and total cost of ownership.

This role requires deep technical leadership, cross-functional collaboration, and influence at senior management levels to drive revenue and strategic success.