Staff Process Engineer, Advanced Packaging & CMP

Micron Technology, Inc; Boise (ID); On-site; USD 120,000 - 180,000; Full time

Benefits offered by this job

Medical, dental & vision plans

Paid time off

Paid holidays

Family leave

Job summary

Micron Technology, Inc. is hiring a Staff Process Engineer for Advanced Packaging CMP in Boise, ID. You will start up and optimize CMP processes, drive yield, cost reductions and reliability improvements, and work with regional and vendor teams to resolve manufacturing challenges.

The role emphasizes failure analysis, FMEA/8D methods, and collaboration across disciplines, with a focus on AI-enabled process improvements and cutting-edge 300mm wafer technologies.

Qualifications

• BS or MS in STEM field with 5+ years CMP experience in semiconductors.
• Hands-on CMP equipment operation and metrology experience.
• Strong communication skills and collaboration across regions.

Responsibilities

• Start up, develop and optimize CMP processes to improve yield and reliability.
• Identify, diagnose and resolve assembly process problems using FMEA/8D/SPC methods.
• Lead multi-functional projects and mentor teams to implement improvements.

Skills

CMP process

Process optimization

Data analysis

Education

BS/MS in Materials Science/Chemical/Electrical/Mechanical/Physics/Chemistry

Tools

AMAT LKP

EBARA-300X

Optical metrology

Profilometry

Polishing slurries

Polishing pads

Job description

Micron Technology, Inc. is hiring a Staff Process Engineer for Advanced Packaging CMP in Boise, ID. You will start up and optimize CMP processes, drive yield, cost reductions and reliability improvements, and work with regional and vendor teams to resolve manufacturing challenges.

The role emphasizes failure analysis, FMEA/8D methods, and collaboration across disciplines, with a focus on AI-enabled process improvements and cutting-edge 300mm wafer technologies.