Senior Process Development Engineer - AI-Driven Packaging

Micron Technology

Boise (ID)

On-site

USD 180,000 - 300,000

Full time

2 days ago
Be an early applicant
Application generator

An application made for this job — a tailored resume and cover letter that speak straight to the posting.

Get past ATS filters

Benefits offered by this job

Medical, dental and vision plans
Paid time-off
Paid holidays

Job summary

Micron Technology is seeking an experienced organizational leader to drive methodology improvements and apply AI/advanced analytics to guide strategy for the most advanced memory products, including HBM, 3DS DRAM, and emerging 3D architectures. You will steer end-to-end technology execution, partnering across organizations to influence internal roadmaps and the external ecosystem.

This high-impact role demands leading complex cross-functional programs and mentoring others while shaping future

Qualifications

  • MS in Chemistry, Chemical Engineering, Materials Science, or related field (or equivalent experience).
  • 15+ years in semiconductor process development, manufacturing, or advanced packaging.
  • Strong understanding of wafer-level or die-level processes and materials interactions.

Responsibilities

  • Own advanced packaging process technologies across wafer-level and die-level modules from pathfinding through manufacturing readiness.
  • Develop and mature novel process flows, materials, and integration schemes that meet electrical, mechanical, thermal, cost, and reliability needs.
  • Lead FOAK development, supplier engagement, and ecosystem collaboration to close capability gaps and accelerate learning.
  • Drive structured problem solving for multi-domain technical challenges and guide strategic decisions across programs.
  • Lead technology transfer to manufacturing and influence packaging and integration decisions across product teams.
  • Expected to leverage AI-enabled tools, automation, data analytics, and advanced modeling methods to accelerate process development, strengthen decision-making, and improve technical outcomes across advanced packaging programs.

Skills

Process development leadership
Cross-functional programs
AI/advanced analytics
Data-driven decision making

Education

MS in Chemistry, Chemical Engineering, or Materials Science

Job description

Micron Technology is seeking an experienced organizational leader to drive methodology improvements and apply AI/advanced analytics to guide strategy for the most advanced memory products, including HBM, 3DS DRAM, and emerging 3D architectures. You will steer end-to-end technology execution, partnering across organizations to influence internal roadmaps and the external ecosystem.

This high-impact role demands leading complex cross-functional programs and mentoring others while shaping future

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

DMTS Process Development Engineer — AI-Enabled Packaging
DMTS Process Development Engineer — AI-Enabled Packaging

Micron Technology, Inc • Boise (ID)

On-site
USD 140,000 - 210,000
Medical, dental and vision plans
Paid time off
Paid holidays
+1
Senior Process Development Lead, Advanced Packaging
Senior Process Development Lead, Advanced Packaging

1000 Micron Technology, Inc. • Boise (ID)

On-site
USD 180,000 - 240,000
Medical, dental and vision plans
Paid time‑off
Paid holidays
Director, DRAM Packaging: AI-Driven 3D/HBM Innovation
Director, DRAM Packaging: AI-Driven 3D/HBM Innovation

Micron Technology, Inc • Boise (ID)

On-site
USD 220,000 - 320,000
Senior Director, Advanced Packaging Process Integration
Senior Director, Advanced Packaging Process Integration

1000 Micron Technology, Inc. • Idaho City (ID)

On-site
USD 180,000 - 240,000
Medical, dental and vision plans
Paid time off and holidays
Paid family leave
+1
DMTS Process Development Engineer, Advanced Packaging
DMTS Process Development Engineer, Advanced Packaging

1000 Micron Technology, Inc. • Boise (ID)

On-site
USD 180,000 - 240,000
Medical, dental and vision plans
Paid time‑off
Paid holidays
Senior IC Package Design Engineer - Lead AI-Scale Packaging
Senior IC Package Design Engineer - Lead AI-Scale Packaging

1000 Micron Technology, Inc. • Boise (ID)

On-site
USD 150,000 - 190,000
Health insurance
Paid time off
Retirement plan
DMTS Process Development Engineer, Advanced Packaging
DMTS Process Development Engineer, Advanced Packaging

Micron Technology • Boise (ID)

On-site
USD 180,000 - 300,000
Medical, dental and vision plans
Paid time-off
Paid holidays
DMTS Process Development Engineer, Advanced Packaging
DMTS Process Development Engineer, Advanced Packaging

Micron Technology, Inc • Boise (ID)

On-site
USD 140,000 - 210,000
Medical, dental and vision plans
Paid time off
Paid holidays
+1
Memory Packaging Architect: Pathfinding Next-Gen AI Systems
Memory Packaging Architect: Pathfinding Next-Gen AI Systems

Micron Technology • Boise (ID)

On-site
USD 143,000 - 398,000
Medical, dental and vision plans
Paid time off and holidays
Benefits guide and programs
Senior Director, Advanced Packaging Process Integration
Senior Director, Advanced Packaging Process Integration

Micron Technology, Inc. • Boise (ID)

On-site
USD 180,000 - 240,000
Medical, dental and vision plans
Paid time off
Paid holidays