Senior RDA Engineer: Advanced Packaging Innovator

Micron Memory Malaysia Sdn Bhd; Boise (ID); On-site; USD 110,000 - 160,000; Full time

Benefits offered by this job

Medical, dental, vision plans

Paid time off

401(k) with company match

Job summary

Micron Technology in Boise, Idaho is seeking a Senior RDA Engineer in Advanced Packaging to learn and apply defect detection and data-driven improvement. You will review experimental flows, analyze anomalies, and drive faster learning and technology transfer across TD and global teams.

The role emphasizes root-cause analysis, scripting for data manipulation, and collaboration with process integration and yield teams.

Qualifications

• BS in EE/ChemE/MSE or related field with 4–6 years in semiconductors.
• Experience identifying and resolving defect integration issues (RDA).
• Knowledge of semiconductor fabrication techniques and equipment concepts.

Responsibilities

• Review experimental process flows for defect anomalies and quarantine out-of-control tools.
• Use new inspection tools to detect problems earlier and locate sources.
• Collaborate with global teams to share methods and align sites.
• Support experimentation, data analysis, and metric tracking.

Skills

RDA experience

Data science

Scripting / coding

English communication

Education

Bachelors in EE/ChemE/MSE

Tools

SEM

X-ray

Laser systems

Data analysis tools

Job description

Micron Technology in Boise, Idaho is seeking a Senior RDA Engineer in Advanced Packaging to learn and apply defect detection and data-driven improvement. You will review experimental flows, analyze anomalies, and drive faster learning and technology transfer across TD and global teams.

The role emphasizes root-cause analysis, scripting for data manipulation, and collaboration with process integration and yield teams.