Director, Advanced Packaging: 2.5D/3D Integration Lead

Micron Technology, Inc.; Boise, Northern (ID, KY); Hybrid; USD 180,000 - 280,000; Full time

Job summary

Micron Technology, Inc. is seeking a Director / DMTS, Process Integration Lead for Advanced Packaging (2.5D/3D, HBM, Hybrid Bonding) in Boise, Idaho.

You will lead a team to develop and integrate packaging technologies from concept to full-scale manufacturing, enabling high-performance multi-die solutions. Responsibilities include technology transfer, warpage mitigation, and cross-functional collaboration with design, process, equipment, reliability, and manufacturing teams.

Qualifications

• Bachelor’s degree in Materials Engineering, Chemical Engineering, or a related field.
• Master’s degree or PhD preferred for advanced qualification.
• Experience with advanced packaging tech development, 2.5D/3D stacking, and HBM integration.

Responsibilities

• Lead a team focused on developing and integrating advanced packaging technologies from concept through full-scale manufacturing.
• Drive technology transfer from development to manufacturing including qualification and validation planning.
• Spearhead warpage prediction/mitigation and validate with inline metrology.
• Collaborate with design, process, equipment, reliability, test, and manufacturing teams to scale solutions globally.
• Manage interconnect architectures, die-stacking, and HBM implementation.
• Define AI-enabled engineering workflows and automation opportunities.

Skills

Advanced packaging tech

2.5D/3D integration

HBM integration

W2W/C2W hybrid bonding

AI-enabled engineering workflows

Technical team leadership

Education

Bachelor’s degree in Materials or Chemical Engineering

Master’s or PhD (preferred)

Job description

Micron Technology, Inc. is seeking a Director / DMTS, Process Integration Lead for Advanced Packaging (2.5D/3D, HBM, Hybrid Bonding) in Boise, Idaho.

You will lead a team to develop and integrate packaging technologies from concept to full-scale manufacturing, enabling high-performance multi-die solutions. Responsibilities include technology transfer, warpage mitigation, and cross-functional collaboration with design, process, equipment, reliability, and manufacturing teams.