New Grad: Process Integration Engineer, Advanced Packaging

Micron Technology, Inc

Boise (ID)

On-site

USD 85,000 - 120,000

Full time

14 days+
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Benefits offered by this job

Medical, dental and vision plans
Paid time off
Paid holidays

Job summary

Micron Technology, Inc in Boise, ID invites a New College Grad Process Integration Engineer to contribute to advanced packaging development and integration for next-generation memory products.

You will work in a collaborative R&D environment, applying data-driven techniques and AI-enabled tools to analyze results, support experiments, and help drive technology qualification. This role emphasizes safety, quality, and continuous learning, with opportunities to collaborate across engineering teams.

Qualifications

  • Master's degree or equivalent in Electrical Engineering, Materials Science, Mechanical Engineering, Physics, Chemistry, or related engineering/science field.
  • Knowledge of semiconductor manufacturing, process integration, materials engineering, device physics, or advanced packaging through coursework, research, internships, or industry experience.
  • Demonstrated analytical and problem-solving skills through academic research, internships, laboratory work, or engineering projects.
  • Ability to work effectively in a collaborative, multi-functional team environment and communicate technical concepts clearly.
  • Experience using data analysis tools and a willingness to learn AI-assisted technologies that improve engineering productivity and decision-making.

Responsibilities

  • Support the development, characterization, and integration of groundbreaking packaging and interconnect solutions for next-generation semiconductor products.
  • Collaborate with multi-functional engineering teams to analyze process data, solve technical challenges, and improve technology performance.
  • Participate in experiments, process evaluations, and technology qualification activities to support development objectives.
  • Utilize AI-enabled and data-driven tools to analyze engineering results, identify trends, and support technical decision-making.
  • Promote a culture of safety, quality, compliance, and continuous learning.

Skills

Analytical skills
Problem-solving
Data analysis
Team collaboration
Communication
Willingness to learn AI tools

Education

Master's degree or equivalent in Electrical Engineering, Materials Science, Mechanical Engineering, Physics, Chemistry, or related field

Tools

Data analysis tools

Job description

Micron Technology, Inc in Boise, ID invites a New College Grad Process Integration Engineer to contribute to advanced packaging development and integration for next-generation memory products.

You will work in a collaborative R&D environment, applying data-driven techniques and AI-enabled tools to analyze results, support experiments, and help drive technology qualification. This role emphasizes safety, quality, and continuous learning, with opportunities to collaborate across engineering teams.

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