Senior Power Packaging Engineer - SiP & Flip-Chip

Renesaselectronics; Tempe (AZ); On-site; USD 120,000 - 180,000; Full time

Job summary

Renesas Electronics seeks a senior packaging engineer to design and develop power SiP/module packaging, including wafer-level and flip-chip interconnects. You will benchmark materials, qualify processes and collaborate with OSAT/CM suppliers to ensure robust production ramp and quality.

The role involves DOE studies and active participation in packaging roadmap development. You will work with Product, Reliability, and Operations teams to resolve process issues and drive continuous improvement,

Qualifications

• Doctorate/Masters / Bachelor's Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
• 10-15 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip LGA packaging.
• Strong understanding of power SiP/modules which has an substrate or embedded die/capacitor, assembly process knowledge, qualification methods, SPC and statistical analysis software.
• Strong interpersonal and communication skills.
• Strong analytical and presentation skills.

Responsibilities

• Design and develop package and interconnect methods for Renesas packaging needs for Power SiP/modules and related technologies.
• Benchmark, select and qualify materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
• Run DOE to optimize processes and establish process specs.
• Work with OSAT/CM to ensure smooth production ramps and early issue resolution.
• Develop and maintain expertise on advances in power SiP/modules, wafer-level packaging & flip-chip interconnects.
• Participate in packaging roadmap development and execute plans.
• Address customer complaints with peers across Marketing, Product, Quality and Operations.

Skills

Power SiP modules

Wafer-level packaging

SPC/DOE analysis

Interpersonal skills

Analytical skills

Education

PhD/MSc/BSc in Physics, Chemistry, Mechanical, Electrical or Materials Engineering

Job description

Renesas Electronics seeks a senior packaging engineer to design and develop power SiP/module packaging, including wafer-level and flip-chip interconnects. You will benchmark materials, qualify processes and collaborate with OSAT/CM suppliers to ensure robust production ramp and quality.

The role involves DOE studies and active participation in packaging roadmap development. You will work with Product, Reliability, and Operations teams to resolve process issues and drive continuous improvement,