Lead Advanced IC Packaging Engineer: 2.5D/3D, SiP, Power

Talanto; Austin (TX); On-site; USD 150,000 - 210,000; Full time

Benefits offered by this job

Competitive benefits package

Job summary

Renesas is seeking a Principal Package Design Engineer to lead next-generation packaging solutions for high-performance semiconductors. The role focuses on advanced package architectures, assembly processes, thermal/mechanical reliability, and cross-functional collaboration with design, applications, product engineering, and manufacturing teams.

The ideal candidate will have deep expertise in packaging technologies, 5+ years of experience, and a track record of bringing complex products from

Qualifications

• Advanced packaging or electronics packaging and system integration experience.
• Strong hands-on knowledge of packaging technologies, materials, and assembly processes.
• Experience with AI infrastructure and data center power management is a plus.
• Proven ability to lead projects and work cross-functionally with design, manufacturing, and suppliers.
• Knowledge of reliability testing and qualification standards.

Responsibilities

• Lead design, development, and qualification of advanced semiconductor packaging solutions.
• Define package architecture based on electrical, thermal, mechanical and cost needs.
• Drive OSAT selection and development for new product introductions (NPI).
• Collaborate with IC design, substrate, board, thermal and reliability teams.
• Oversee package layout, stack-up definition, materials, interconnect strategy.
• Perform simulations for SI/PI, thermal, mechanical stress; guide others.
• Develop assembly flows and qualification plans; lead DOE and reliability tests.
• Resolve packaging issues and drive root-cause/corrective actions.
• Create package specifications, design rules, and technical reports; mentor juniors.

Skills

Advanced packaging engineering/design

Materials selection

Thermal/Mechanical simulations

Failure analysis & reliability

Design for Manufacturability

Technical leadership & problem-solving

Education

MSc or PhD in EE/Materials/Mechanical/Chemical or related field

Tools

Cadence Allegro Package Designer

SolidWorks

ANYSYS

COMSOL

JMP / Minitab

JEDEC/IPC standards knowledge

Job description

Renesas is seeking a Principal Package Design Engineer to lead next-generation packaging solutions for high-performance semiconductors. The role focuses on advanced package architectures, assembly processes, thermal/mechanical reliability, and cross-functional collaboration with design, applications, product engineering, and manufacturing teams.

The ideal candidate will have deep expertise in packaging technologies, 5+ years of experience, and a track record of bringing complex products from