Director of Advanced IC Packaging & Power SiP Solutions

Renesas Electronics; California (MO); On-site; USD 200,000 - 250,000; Full time

Benefits offered by this job

Medical insurance

Health savings account

Dental insurance

Vision insurance

Flexible spending accounts

Life insurance

Job summary

Renesas Electronics seeks a Director of Advanced IC Packaging Development to lead the Next Generation Power Packaging roadmap. You will drive R&D from concept through NPI to high-volume OSAT management, enabling AI and data center progress with Smart Power Stages and Wide Bandgap solutions.

You will oversee budgets, participate in customer adoption programs, and establish design rules to ensure manufacturability and reliability across global packaging platforms.

Qualifications

• PhD/ MSc/ Bachelors in physics, chemistry, mechanical, electrical or materials engineering.
• 15–20 years in semiconductor package development with power SIP/modules, wafer level and flip-chip packaging.
• Deep knowledge of Power SiP/Modules, Flip-Chip, Wafer Level assembly.
• Familiarity with Smart Power Stages and Vertical Power architectures.

Responsibilities

• Define and execute the global packaging roadmap including Power SiP/Modules, Wafer Level Packaging, and Flip-Chip technologies.
• Lead R&D initiatives for SiC and GaN power devices with modern substrates like DBC and AMB.
• Manage annual R&D budget and oversee customer adoption programs aligning tech with market demand.
• Establish corporate design rules to ensure manufacturability and reliability.

Skills

Power SiP/Modules

Flip-Chip

Wafer Level Packaging

Wide Bandgap SiC/GaN

DOE

SPC

OSAT management

Interconnect methods

Education

Doctorate/Master’s/Bachelor’s in Physics, Chemistry, Mechanical, Electrical or Materials Engineering

Tools

DBC (Direct Bonded Copper)

AMB (Active Metal Brazing)

Job description

Renesas Electronics seeks a Director of Advanced IC Packaging Development to lead the Next Generation Power Packaging roadmap. You will drive R&D from concept through NPI to high-volume OSAT management, enabling AI and data center progress with Smart Power Stages and Wide Bandgap solutions.

You will oversee budgets, participate in customer adoption programs, and establish design rules to ensure manufacturability and reliability across global packaging platforms.