Senior Advanced Packaging Engineer: 2.5D/3D & SiP

Renesas Electronics; California (MO); On-site; USD 100,000 - 140,000; Full time

Benefits offered by this job

Short-Term Incentive program

Long-Term Incentive equity grant

Job summary

Renesas Electronics is seeking a Senior Advanced Packaging Engineer in California to lead the development and integration of innovative packaging solutions for high-performance electronics. You will be responsible for designing and qualifying next-generation semiconductor packaging while collaborating with various engineering teams.

The ideal candidate should hold an MSc or PhD in a relevant field and have over 5 years of experience in semiconductor packaging. The role offers exciting short-term and long-term incentive opportunities based on performance.

Qualifications

• 5+ years of experience in semiconductor packaging or advanced electronics packaging.
• Strong knowledge of advanced packaging technologies, materials, and assembly processes.
• Experience with package reliability testing and qualification standards.

Responsibilities

• Lead the design and qualification of semiconductor packaging solutions.
• Define package architecture based on reliability and cost requirements.
• Collaborate with design and manufacturing teams to ensure package performance.

Skills

Deep expertise in semiconductor packaging technologies

Strong project leadership

Thermal and mechanical reliability knowledge

Cross-functional communication

Troubleshooting packaging failures

Education

MSc or PhD degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related field

Tools

Cadence Allegro Package Designer

Solid Works

ANSYS

COMSOL

JMP / Minitab

Job description

Renesas Electronics is seeking a Senior Advanced Packaging Engineer in California to lead the development and integration of innovative packaging solutions for high-performance electronics. You will be responsible for designing and qualifying next-generation semiconductor packaging while collaborating with various engineering teams.

The ideal candidate should hold an MSc or PhD in a relevant field and have over 5 years of experience in semiconductor packaging. The role offers exciting short-term and long-term incentive opportunities based on performance.