Director, Power Packaging & SiP Innovation

Renesas Electronics; Phoenix (AZ); On-site; USD 180,000 - 240,000; Full time

Job summary

Renesas Electronics seeks an senior-level packaging expert to lead high-power SiP/module packaging development for AI/datacenter applications. You will drive process optimization, supplier collaboration, and robust qualification programs.

You will coordinate cross-functional teams across R&D, Product, and Quality to ensure on-time delivery and scalable packaging solutions. This role is on-site in the Phoenix area, with a focus on advancement of power packaging technologies and reliability.

Qualifications

• PhD/Master/Bachelor in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
• 15–20 years of package development experience emphasizing power SiP/modules and wafer-level packaging.
• Strong interpersonal and communication skills with cross-functional teaming.
• Sound understanding of wire-bonding and multi-chip module technologies.

Responsibilities

• Lead package development/NPI, R&D, OSAT management for new package development and qualification.
• Develop and optimize packaging designs for AI/Data center power applications (SiP, DBC, GaN/SiC focus).
• Coordinate with OSAT/CM, run DOE to optimize processes and establish specs.
• Ensure production readiness, ramp-up monitoring, and quality controls.

Skills

Power SiP/modules understanding

Wire-bonding & MCM technologies

Strong interpersonal & communication

Analytical & presentation skills

DOE/Process optimization knowledge

Education

PhD/Master/Bachelor in Physics, Chemistry, Mechanical, Electrical or Materials Eng

15-20 years in package development (power SiP/module)

Tools

SPC/statistical analysis software

Job description

Renesas Electronics seeks an senior-level packaging expert to lead high-power SiP/module packaging development for AI/datacenter applications. You will drive process optimization, supplier collaboration, and robust qualification programs.

You will coordinate cross-functional teams across R&D, Product, and Quality to ensure on-time delivery and scalable packaging solutions. This role is on-site in the Phoenix area, with a focus on advancement of power packaging technologies and reliability.