Senior SiPh Packaging & Assembly Expert

GlobalFoundries inc.

Essex Junction (VT)

On-site

USD 167,000 - 290,000

Full time

6 days ago
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Job summary

GlobalFoundries is a leading semiconductor foundry seeking an experienced DMTS-grade professional to drive SiPhotonics packaging development, including 2.5D/3D co-packaged optics and reliability. The role focuses on defining test plans, materials selection, and integration with electrical interconnects in collaboration with OSAT partners.

The candidate will lead packaging design reviews, assess risks with FMEAs, and ensure products meet high reliability standards for data centers, automotive,

Qualifications

  • MS or PhD in a relevant field and 20+ years of experience.
  • Expertise in photonic and electronic package architecture definition.
  • Broad and deep knowledge of global technology and trends in design or manufacturing.
  • Experience bringing packaged products from development into production for data centers, automotive, and communications.
  • Expert in chip package interaction for 2D, 2.5D, 3D SiPh advanced packaging.

Responsibilities

  • Lead SiPh packaging subject matter expert through internal and external questions and training.
  • Provide leadership in product packaging design reviews and FMEAs for customer concepts.
  • Ensure technologies meet standardized quality expectations for data centers, automotive, and communications.
  • Drive global SiPh advanced packaging innovations and design enablement for customers and efficient manufacturing.
  • Support environmental, health, safety and security requirements and programs.

Skills

Photonic/electronic packaging
Global technology trends
Customer packaging concept reviews

Education

MS or PhD in a relevant field

Tools

FMEA
DOE
Thermal/mechanical simulation

Job description

GlobalFoundries is a leading semiconductor foundry seeking an experienced DMTS-grade professional to drive SiPhotonics packaging development, including 2.5D/3D co-packaged optics and reliability. The role focuses on defining test plans, materials selection, and integration with electrical interconnects in collaboration with OSAT partners.

The candidate will lead packaging design reviews, assess risks with FMEAs, and ensure products meet high reliability standards for data centers, automotive,

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