Optical Packaging Architect for SiPh & Co-Packaged Optics

GlobalFoundries inc.; Essex Junction (VT); On-site; USD 143,000 - 247,000; Full time

Job summary

GlobalFoundries Inc. in the United States is seeking a Packaging Engineer within its Integrated Optics group to lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged optics (CPO) platforms.

You will collaborate across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low-loss, and cost-effective packaging architectures that meet stringent performance and reliability targets.

Qualifications

• 8+ years of experience in semiconductor packaging with photonics focus.
• Hands-on fiber attach, photonic alignment, and optical coupling techniques.
• Familiar with die attach, flip-chip, underfill, molding, and micro-optics.
• Strong English communication and cross-functional collaboration.

Responsibilities

• Define optical packaging architectures for SiPh modules and thermal/mechanical integration.
• Develop fiber-to-chip coupling strategies for high-density I/O.
• Lead HI using 2.5D/3D/3.5D packaging technologies.
• Perform multiphysics simulations to optimize performance and reliability.
• Lead root cause analysis for yield and reliability issues with FMEA/DOE.
• Collaborate with OSATs and manufacturing for mass production readiness.
• Present updates and roadmaps to stakeholders.

Skills

Semiconductor packaging

Photonic alignment

Analytical skills

English communication

Education

Master's degree or higher in Packaging/Materials Science/Mechanical/Optical Engineering

Tools

Lumerical

COMSOL

Job description

GlobalFoundries Inc. in the United States is seeking a Packaging Engineer within its Integrated Optics group to lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged optics (CPO) platforms.

You will collaborate across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low-loss, and cost-effective packaging architectures that meet stringent performance and reliability targets.