Senior Optical Packaging Engineer: Fiber-to-Chip Lead

PsiQuantum; Milpitas (CA); On-site; USD 190,000 - 230,000; Full time

Job summary

PsiQuantum in Milpitas, CA seeks a Senior Optical Packaging Engineer to design and implement high-performance fiber-to-chip packages and scalable packaging processes for photonic ICs.

You will lead packaging prototypes, define DFM requirements, work with manufacturing and suppliers, and help scale assembly lines to meet production demands. This is a senior, full-time role in the Edge Coupling team within hardware engineering.

Qualifications

• Master’s degree or higher in Engineering, Physics, or Materials Science.
• 10+ years in PIC packaging design and multi-chip assemblies.
• 5+ years with optical fibers and measurements.
• 5+ years OSAT/EOL experience in semiconductor packaging.
• 5+ years FAU / optical connector to chip attachment.
• Experience with fiber attach tooling and process/flow development.
• Experience with FA and 8D failure resolution techniques.
• Experience with yield and reliability metrics.

Responsibilities

• Develop optical package and high-accuracy fiber-to-chip alignment for scalable assembly.
• Create packaging prototypes and flows; review BOMs with supply chain.
• Update DFM requirements and feed back to packaging design.
• Plan and analyze experiments to improve optical package performance.
• Partner with manufacturing and vendors to transfer designs.
• Advise on setup of high-throughput packaging lines.
• Source materials with vendors and provide requirements feedback.

Skills

Optical packaging

Fiber-to-chip alignment

DFM (design for manufacturing)

Experiment design

Vendor collaboration

Process development

Yield analysis

Supplier management

Education

Master's degree or above in Engineering/Physics/Materials Science

Tools

OSAT experience

Optical fiber tooling

Process measurement tools

Job description

PsiQuantum in Milpitas, CA seeks a Senior Optical Packaging Engineer to design and implement high-performance fiber-to-chip packages and scalable packaging processes for photonic ICs.

You will lead packaging prototypes, define DFM requirements, work with manufacturing and suppliers, and help scale assembly lines to meet production demands. This is a senior, full-time role in the Edge Coupling team within hardware engineering.