Senior Optical Packaging Engineer

PsiQuantum; Milpitas (CA); On-site; USD 190,000 - 230,000; Full time

Job summary

PsiQuantum in Milpitas, CA seeks a Senior Optical Packaging Engineer to design and implement high-performance fiber-to-chip packages and scalable packaging processes for photonic ICs.

You will lead packaging prototypes, define DFM requirements, work with manufacturing and suppliers, and help scale assembly lines to meet production demands. This is a senior, full-time role in the Edge Coupling team within hardware engineering.

Qualifications

• Master’s degree or higher in Engineering, Physics, or Materials Science.
• 10+ years in PIC packaging design and multi-chip assemblies.
• 5+ years with optical fibers and measurements.
• 5+ years OSAT/EOL experience in semiconductor packaging.
• 5+ years FAU / optical connector to chip attachment.
• Experience with fiber attach tooling and process/flow development.
• Experience with FA and 8D failure resolution techniques.
• Experience with yield and reliability metrics.

Responsibilities

• Develop optical package and high-accuracy fiber-to-chip alignment for scalable assembly.
• Create packaging prototypes and flows; review BOMs with supply chain.
• Update DFM requirements and feed back to packaging design.
• Plan and analyze experiments to improve optical package performance.
• Partner with manufacturing and vendors to transfer designs.
• Advise on setup of high-throughput packaging lines.
• Source materials with vendors and provide requirements feedback.

Skills

Optical packaging

Fiber-to-chip alignment

DFM (design for manufacturing)

Experiment design

Vendor collaboration

Process development

Yield analysis

Supplier management

Education

Master's degree or above in Engineering/Physics/Materials Science

Tools

OSAT experience

Optical fiber tooling

Process measurement tools

Job description

Senior Optical Packaging Engineer at PsiQuantum, Milpitas, California. A senior-level full time position in the 4580 - Edge Coupling team, listed under hardware engineering.

Come join us.

Job Summary

The Senior Optical Packaging Engineer is responsible for developing & implementing a high-performance & robust fiber-to-chip package and a scalable packaging process for optical systems comprised of optical fibers attached to a variety of chip-based photonic integrated circuits.

Responsibilities

• Develop an optical package and fiber-to-chip alignment scheme that allows for high alignment accuracy and scalable assembly.
• Help develop packaging prototypes & scalable fiber-to-chip packaging flows, NPI.Review packaging design BOMs, work with supply chain on procuring parts needed for assembly.
• Establish and update version-controlled DFM requirements and feed back to packaging design group.
• Design, execute, summarize and analyze experiments & process trend studies to improve the performance and reliability of optical packaged assemblies.
• Work with manufacturing group and vendors on transferring & scaling packaging designs and processes based on successful prototypes.
• Advise manufacturing group and vendors on setup of high-throughput packaging assembly lines.
• Work with external vendors and suppliers to source required materials and provide feedback on evolving requirements.

Requirements

• Master’s Degree or above in Engineering, Physics or Material Science.
• 10+ years of experience with/at semiconductor company or supplier working on PIC packaging design, qualification & multi-chip assemblies.
• 5+ years of experience working with optical fibers, optical measurements.
• 5+ years of work experience with advanced semiconductor packaging OSAT (Outsourced Semiconductor Assembly & Test) and/or EOL vendors.
• 5+ years of experience with semiconductor company or supplier working on FAU / optical connector to chip attachment.
• Experience with fiber attach tooling & process/flow development and optical data analysis.
• Experience with FA and 8D failure resolution techniques.
• Experience with developing metrics for yield and quality management, including reliability and yield based on optical and mechanical performance.