Senior Optical Packaging Engineer — Equity-Eligible, High-Impact

PSI Quantum; Milpitas (CA); On-site; USD 160,000 - 180,000; Full time

Job summary

PsiQuantum in Milpitas, CA is seeking a Senior Optical Packaging Engineer to lead the development of high-performance fiber-to-chip packages and scalable packaging processes for photonic ICs. You’ll design alignment schemes, prototype flows, and collaborate with manufacturing to scale production while maintaining quality and reliability.

The role requires a Master’s degree and 10+ years in semiconductor packaging, with hands-on experience in fiber attach tooling, OSAT collaboration, and optical

Qualifications

• Master's Degree or above in Engineering, Physics or Material Science.
• 10+ years of experience with/at semiconductor company or supplier working on PIC packaging design, qualification & multi-chip assemblies.
• 5+ years of experience working with optical fibers, optical measurements.
• 5+ years of work experience with semiconductor OSAT (Outsourced Semiconductor Assembly & Test) and/or EOL vendors.
• 5+ years of experience with FAU / optical connector to chip attachment.
• Experience with fiber attach tooling & process/flow development and optical data analysis.
• Experience with FA and 8D failure resolution techniques.
• Experience with developing metrics for yield and quality management, including reliability and yield based on optical and mechanical performance.

Responsibilities

• Develop an optical package and fiber-to-chip alignment scheme that allows for high alignment accuracy and scalable assembly.
• Help develop packaging prototypes & scalable fiber-to-chip packaging flows, NPI.Review packaging design BOMs, work with supply chain on procuring parts needed for assembly.
• Establish and update version-controlled DFM requirements and feed back to packaging design group.
• Design, execute, summarize and analyze experiments & process trend studies to improve the performance and reliability of optical packaged assemblies.
• Work with manufacturing group and vendors on transferring & scaling packaging designs and processes based on successful prototypes.
• Advise manufacturing group and vendors on setup of high-throughput packaging assembly lines.
• Work with external vendors and suppliers to source required materials and provide feedback on evolving requirements.

Skills

Optical measurements

Fiber-to-chip alignment

Packaging design collaboration

Education

Master's Degree or above in Engineering/Physics/Material Science

Tools

FAU / optical connector to chip attachment

fiber attach tooling

OSAT collaboration

Job description

PsiQuantum in Milpitas, CA is seeking a Senior Optical Packaging Engineer to lead the development of high-performance fiber-to-chip packages and scalable packaging processes for photonic ICs. You’ll design alignment schemes, prototype flows, and collaborate with manufacturing to scale production while maintaining quality and reliability.

The role requires a Master’s degree and 10+ years in semiconductor packaging, with hands-on experience in fiber attach tooling, OSAT collaboration, and optical