Senior Packaging SIPI Engineer — Signal & Power Lead

QUALCOMM, Inc.; San Diego (CA); On-site; USD 192,000 - 288,000; Full time

Benefits offered by this job

RSU grants

Annual bonus

Comprehensive benefits

Job summary

Qualcomm Technologies, Inc. is seeking a senior leader for the Package Electrical Team focused on signal integrity and power integrity.

The role collaborates with package and IC designers, PHY owners, and PCB teams to optimize the overall package design and perform system simulations before tape-out. The candidate will guide design guidelines, automate flows, and present findings to upper management, supporting multi-geography teams and driving key decisions across packaging, PCB, and PHY

Qualifications

• Bachelor’s, Master’s, or PhD in a relevant engineering field with strong package/system experience.
• Extensive background in package design and system analysis.
• Experience leading multi-site/geo teams preferred.
• Strong communication with PHY, PCB, and design teams.

Responsibilities

• Perform package extraction for the time-domain and frequency-domain analysis.
• Perform system-level analysis for DDR, SerDes & Mixed signal interfaces.
• Provide design guidelines for Package design and optimization.
• Develop design & analysis flow and automate the process.
• Create technical documentation and presentations.
• Collaborate across PHY, package, and PCB teams to update design guidelines.

Skills

Leadership

Communication

System‑level thinking

Education

Bachelor's degree in Chemical Engineering

Bachelor's degree in Electrical Engineering

Bachelor's degree in Mechanical Engineering

Master's degree in Chemical Engineering

Master's degree in Electrical Engineering

PhD in Chemical Engineering

PhD in Electrical Engineering

Tools

HFSS

Q3D

Sentinel-PSI

Clarity

ADS

Hspice

Job description

Qualcomm Technologies, Inc. is seeking a senior leader for the Package Electrical Team focused on signal integrity and power integrity.

The role collaborates with package and IC designers, PHY owners, and PCB teams to optimize the overall package design and perform system simulations before tape-out. The candidate will guide design guidelines, automate flows, and present findings to upper management, supporting multi-geography teams and driving key decisions across packaging, PCB, and PHY