Senior Package SI Engineer – DDR & Power Integrity

QUALCOMM, Inc.; Oregon; Hybrid; USD 210,000 - 315,000; Full time

Job summary

Qualcomm Technologies, Inc. seeks an experienced Package System Design and Technology Engineer to drive new package technology, from concept to NPI, focusing on high-speed memory interfaces, multi-physics simulations, and reliability.

You will collaborate with IC, board, and package designers, perform signal and power integrity tasks, and validate with lab correlations supporting high-performance, low-cost, easy-to-implement systems for end customers.

Qualifications

• 8+ years of experience in DDR in Package/PCB/System Design related to compute/server standards.
• Experience in electromagnetics and transmission line theory and crosstalk.
• Proficiency in HFSS, Q3D, Sentinel-PSI, Clarity, and SPICE (ADS, Hspice) with IBIS/IBIS AMI models.
• Experience in DDR design specifications such as DDR and LPDDR.
• Matlab for automating simulation workflows.
• Programming in C/C++ or scripting in Perl/Python is a plus.

Responsibilities

• Perform IO analyses using established methodologies from modeling to simulation and reporting.
• Analyze IO power distribution in product development and reference systems.
• Perform package extraction for time/ frequency domain analysis and provide design guidelines.
• Document results clearly and completely.

Job description

Qualcomm Technologies, Inc. seeks an experienced Package System Design and Technology Engineer to drive new package technology, from concept to NPI, focusing on high-speed memory interfaces, multi-physics simulations, and reliability.

You will collaborate with IC, board, and package designers, perform signal and power integrity tasks, and validate with lab correlations supporting high-performance, low-cost, easy-to-implement systems for end customers.