Senior SIPI Engineer: Signal & Power Integrity

Qualcomm; San Diego (CA); On-site; USD 134,000 - 201,000; Full time

Benefits offered by this job

Discretionary bonus program

RSU grants

Job summary

Qualcomm Technologies, Inc. is seeking a skilled engineer to optimize system performance through collaboration with IC, Package, and PCB designers. The role focuses on substrate constraints, IP specs, and ball assignment impacts on overall performance.

You will perform package extraction, system-level analyses for DDR/SerDes, and develop guidelines for package and PCB design while creating technical docs and presentations. This position offers cross-team exposure across PKG, IP and PCB groups.

Qualifications

• Bachelor's degree in Electrical Engineering, Chemical Engineering, Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience.
• Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 1+ year of System/Package Design/Technology Engineering or related work experience.
• PhD in related field may be considered with minimal experience.

Responsibilities

• Perform package extraction for time-domain and frequency-domain analysis.
• Perform system-level analysis for DDR, SerDes & PDN.
• Develop design guidelines for Package and PCB design.
• Create technical documentation and presentations.

Skills

DDR/SerDes experience

Electromagnetics

Transmission line theory

Crosstalk

HFSS

Q3D

Sentinel-PSI

Clarity

ADS

Hspice

Cadence Allegro

Mentor Xpedition

MATLAB

LPDDRx / PCIe / Xlink

Education

Master's degree in Electrical Engineering, Chemical Engineering, Mechanical Engineering, or related field

PhD with minimal experience considered

Bachelor's degree in Electrical Engineering or related field

Tools

HFSS

Q3D

Sentinel-PSI

Clarity

ADS

Hspice

Cadence Allegro

Xpedition

Job description

Qualcomm Technologies, Inc. is seeking a skilled engineer to optimize system performance through collaboration with IC, Package, and PCB designers. The role focuses on substrate constraints, IP specs, and ball assignment impacts on overall performance.

You will perform package extraction, system-level analyses for DDR/SerDes, and develop guidelines for package and PCB design while creating technical docs and presentations. This position offers cross-team exposure across PKG, IP and PCB groups.