Principal Engineer, Signal and Power Integrity

Qualcomm; San Diego (CA); On-site; USD 120,000 - 160,000; Full time

Job summary

Qualcomm Technologies, Inc. seeks a Package System Design and Technology Engineer to drive new advanced package technology development and architecture analysis from package to system level.

You will perform multi-physics simulation-driven design, select next-generation package structures, and lead cross-functional efforts to optimize package systems for high-performance devices. You will collaborate with cross-functional teams across hardware and test groups, influencing product timelines and

Qualifications

• Role requires strong background in package design and system-level analysis.
• Experience with multi-physics simulations and packaging technologies is preferred.

Responsibilities

• As a Package System Design and Technology Engineer, you will drive advanced package technology development from package to system.

Job description

Company

Qualcomm Technologies, Inc.

Job Area

Engineering Group, Engineering Group > Packaging Engineering

General Summary

As a Qualcomm Package System Design and Technology Engineer, you will drive new advanced package technology development, concept design architecture analysis from package to system, new generation product package structure selection, package system design by multi-physics simulation analysis, multi-physic…