Senior Packaging SIPI Engineer — High‑Speed SerDes & SI/PI

Qualcomm; San Diego (CA); On-site; USD 202,000 - 302,000; Full time

Job summary

Qualcomm Technologies, Inc. seeks a senior engineer for Packaging Engineering to advance signal and power integrity.

You will collaborate with package, platform and IC designers to optimize designs, and perform electrical model extraction, simulations and clear reporting of results. Responsibilities include high-speed SerDes analysis for computing/server projects, EM fundamentals, transmission line theory and crosstalk.

Qualifications

• Bachelor's degree in Engineering with 8+ years in system/package design or related work.
• Master's degree in Engineering with 7+ years in system/package design or related work.
• PhD in Engineering with 6+ years in system/package design or related work.

Responsibilities

• Perform IO analysis including model extraction, simulation, and reporting of various serial interfaces.
• Analyze IO power distribution for product development and reference systems.
• Document results clearly and thoroughly.

Skills

Electromagnetics

Transmission line theory

Crosstalk

MATLAB

C/C++

Python

Education

Bachelor's degree in Electrical/ChE/Mechanical Engineering or related field

Master's degree in Electrical/ChE/Mechanical Engineering or related field

PhD in Electrical/ChE/Mechanical Engineering or related field

Tools

HFSS

Q3D

Sentinel-PSI

Clarity

ADS

HSPICE

Job description

Qualcomm Technologies, Inc. seeks a senior engineer for Packaging Engineering to advance signal and power integrity.

You will collaborate with package, platform and IC designers to optimize designs, and perform electrical model extraction, simulations and clear reporting of results. Responsibilities include high-speed SerDes analysis for computing/server projects, EM fundamentals, transmission line theory and crosstalk.