Senior Packaging Integration Architect (2.5D/3D)

Advanced Micro Devices, Inc.; San Jose (CA); On-site; USD 180,000 - 260,000; Full time

Job summary

Advanced Micro Devices, Inc. is seeking a Principal Packaging Integration Engineer who will own packaging architecture decisions from architecture through qualification, pulling together design, process, quality, test, and supply chain into manufacturable, customer-aligned solutions.

This role requires leading cross-functional teams, engaging customers, and driving DFMEA/DFQ reviews while delivering high-performance packaging for FPGA, embedded SoCs, and custom ASICs.

Qualifications

• Expert-level experience in semiconductor packaging technology integration.
• DFM/DFMEA/PFMEA experience and packaging qualification.
• Experience engaging customers and coordinating cross-functional task forces to closure.
• Fluent, confident communicator with engineering teams and customers.
• Willing to fill gaps between functional groups and drive issues to closure.
• Bachelor’s or Master’s degree in Electrical, Materials, Mechanical, or Semiconductor Engineering.

Responsibilities

• Drive packaging architecture decisions for FPGA, embedded SoC, and custom ASIC programs spanning 2.5D/3D.
• Lead DFM and DFMEA reviews and packaging supply qualification.
• Serve as the primary customer-facing contact for assigned programs.
• Organize cross-functional task forces across design, packaging, QA, and supply chain to resolve issues and keep programs on schedule.
• Build durable relationships with customers and internal partners through proactive follow-through.
• Proactively fill gaps between functional groups and track commitments to closure.

Skills

Packaging integration

2.5D/3D tech

IC-PKG-PCB co-design

DFMEA/DFM/PFMEA

Customer engagement

Cross-functional leadership

Communication with customers

Die-to-die interconnect

Power/Signal integrity knowledge

Education

Bachelors or Masters in Electrical/Materials/Mechanical/SE Eng

Tools

Cadence

Synopsys

Ansys

Job description

Advanced Micro Devices, Inc. is seeking a Principal Packaging Integration Engineer who will own packaging architecture decisions from architecture through qualification, pulling together design, process, quality, test, and supply chain into manufacturable, customer-aligned solutions.

This role requires leading cross-functional teams, engaging customers, and driving DFMEA/DFQ reviews while delivering high-performance packaging for FPGA, embedded SoCs, and custom ASICs.