Senior Semiconductor Packaging Architect

Advanced Micro Devices, Inc

San Jose (CA)

On-site

USD 180,000 - 240,000

Full time

4 days ago
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Job summary

Advanced Micro Devices, Inc. is seeking a Principal Packaging Integration Engineer to lead technically sound packaging architecture decisions for 2.5D/3D programs, co-design IC-PKG-PCB with external OSATs, and own programs from architecture through qualification.

You will serve as the primary customer-facing engineering partner, coordinating cross-functional teams and driving issues to closure while ensuring manufacturable, reliable solutions on schedule.

Qualifications

  • Bachelor's or Master's degree in Electrical, Materials, Mechanical, or Semiconductor Engineering or related field.
  • Experience in semiconductor packaging integration and cross-functional program management.

Responsibilities

  • Drive packaging architecture decisions for FPGA, embedded SoC, and custom ASIC programs including 2.5D/3D tech.
  • Lead DFM/DFMEA reviews and packaging supply qualification with OSAT/substrate partners.
  • Serve as primary customer-facing contact for assigned programs and translate needs into technical direction.
  • Coordinate cross-functional task forces across design, packaging, thermal-mechanical, and supply chain to hit schedule.
  • Fill gaps between functional groups and ensure commitments are closed.

Skills

2.5D/3D integration
OPC & MOP co-design
IC-PKG-PCB co-design
DFM/DFMEA/PFMEA
Customer engagement
Cross-functional leadership
Communication skills

Education

Electrical/Materials/Mechanical/Semiconductor Eng degree

Tools

Cadence
Synopsys
Ansys

Job description

Advanced Micro Devices, Inc. is seeking a Principal Packaging Integration Engineer to lead technically sound packaging architecture decisions for 2.5D/3D programs, co-design IC-PKG-PCB with external OSATs, and own programs from architecture through qualification.

You will serve as the primary customer-facing engineering partner, coordinating cross-functional teams and driving issues to closure while ensuring manufacturable, reliable solutions on schedule.

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