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Advanced Micro Devices, Inc. is seeking a Principal Packaging Integration Engineer to lead technically sound packaging architecture decisions for 2.5D/3D programs, co-design IC-PKG-PCB with external OSATs, and own programs from architecture through qualification.
You will serve as the primary customer-facing engineering partner, coordinating cross-functional teams and driving issues to closure while ensuring manufacturable, reliable solutions on schedule.
Advanced Micro Devices, Inc. is seeking a Principal Packaging Integration Engineer to lead technically sound packaging architecture decisions for 2.5D/3D programs, co-design IC-PKG-PCB with external OSATs, and own programs from architecture through qualification.
You will serve as the primary customer-facing engineering partner, coordinating cross-functional teams and driving issues to closure while ensuring manufacturable, reliable solutions on schedule.