3D/2.5D Packaging Architect

Apple, Inc.; San Francisco (CA); Presencial; USD 129 000 - 225 000; Tempo integral

Vantagens oferecidas por esta oferta de emprego

Stock programs

RSU awards

Employee Stock Purchase Plan

Medical and dental coverage

Retirement benefits

Discounted products

Education reimbursement

Relocation assistance

Resumo da oferta

Apple seeks an experienced Packaging Development Engineer to drive next-generation 2.5D/3D packaging integration and technology development. You will lead architecture exploration, qualification, and alignment with silicon, SI/PI, thermal, and manufacturing teams.

Responsibilities include defining test vehicles, managing CPI risks, coordinating with external foundries/OSATs, and driving reliable, cost-optimized packaging solutions for future products.

Qualificações

• Bachelor's degree required.
• PhD and experience in relevant industry preferred.
• Strong technical background in 2.5D/3D packaging and semiconductor integration.
• Knowledge of fab BEoL/MEoL interconnect processing and wafer-level packaging.
• Experience collaborating across cross-functional hardware teams.
• Proven track record with external foundries, OSATs or material vendors.
• Excellent communication and collaboration skills.

Responsabilidades

• Develop advanced packaging architectures and qualification programs for 2.5D/3D technologies.
• Define test vehicles, design rules, and characterization plans to validate interconnect concepts.
• Manage CPI risks and resolve yield, material, and structural issues with failure analysis.
• Drive cross-functional co-optimization across architecture, silicon, SI/PI, and thermal teams.
• Lead external foundry and OSAT partners on roadmaps and high-volume production ramp.

Conhecimentos

2.5D/3D packaging

hybrid bonding

interposers

TSVs

wafer-level packaging

thermal/mechanical reliability

layout/physical design tools

cross-functional collaboration

Formação académica

Bachelor's degree

PhD preferred

Ferramentas

Layout/Physical design tools

Descrição da oferta de emprego

Apple seeks an experienced Packaging Development Engineer to drive next-generation 2.5D/3D packaging integration and technology development. You will lead architecture exploration, qualification, and alignment with silicon, SI/PI, thermal, and manufacturing teams.

Responsibilities include defining test vehicles, managing CPI risks, coordinating with external foundries/OSATs, and driving reliable, cost-optimized packaging solutions for future products.