Senior Packaging Architect — 2.5D/3D & Equity

Flux Computing; Austin (TX); Vor Ort; USD 180.000 - 280.000; Vollzeit

Benefits dieser Stelle

Equity options

Living-Local Bonus

Zusammenfassung

OLIX is seeking an Advanced Packaging Architect to own packaging architecture and roadmap for DX-1 and future products, coordinating with ASIC, optics, mechanical, and systems teams to deliver high-performance packaging solutions.

This role combines hands-on design with strategic leadership, building the packaging function, defining rules and templates, and mentoring engineers to scale packaging across generations on an aggressive schedule.

Qualifikationen

• 10+ years' experience in advanced semiconductor packaging for ASIC or high-performance products.
• Ownership of packaging architecture, technology strategy, or roadmap development.
• Deep front-end package design experience for ASIC-to-substrate integration.
• Experience with 2.5D/3D packaging, multi-die and heterogeneous integration.
• Hands-on capability with package design tools and SI/PI simulation.

Aufgaben

• Own package architecture and design for ASIC-to-substrate integration, including bump/pad mapping and stack-up definition.
• Lead 2.5D and 3D packaging architectures for future products and multi-die integration.
• Define packaging structures meeting electrical, thermal, mechanical, reliability, and manufacturability requirements.
• Translate silicon and system requirements into design rules and implementation strategies.
• Own full package design flow from concept to manufacturing support.
• Mentor engineers and build packaging capability, libraries, and workflows.
• Collaborate with substrate vendors, OSATs, and foundries on feasibility and readiness.

Kenntnisse

Packaging architecture ownership

2.5D/3D package architectures

Die-to-substrate integration

PI/SI simulation

Package design tooling

Team leadership

Vendor collaboration

Cross-functional collaboration

Manufacturability awareness

Reliability and QA

Ausbildung

Degree in engineering or physical sciences

Tools

Cadence Allegro X APD

Siemens Xpedition

Ansys SIwave

Cadence Sigrity

Jobbeschreibung

OLIX is seeking an Advanced Packaging Architect to own packaging architecture and roadmap for DX-1 and future products, coordinating with ASIC, optics, mechanical, and systems teams to deliver high-performance packaging solutions.

This role combines hands-on design with strategic leadership, building the packaging function, defining rules and templates, and mentoring engineers to scale packaging across generations on an aggressive schedule.