Senior 2.5D/3D Packaging Architect

Apple, Inc.; United States; On-site; USD 185,000 - 325,000; Full time

Job summary

Apple, Inc. in the San Francisco Bay Area seeks a Packaging Development Engineer to lead 2.5D/3D packaging integration from concept through qualification, collaborating with silicon, SI/PI, thermal and manufacturing teams.

You will define test vehicles, drive reliability, and manage external partners to ramp high-volume manufacturing. The role emphasizes advanced packaging architectures and cross-functional optimization.

Qualifications

• BS and 10+ years of relevant industry experience.
• PhD and 6+ years of experience in 2.5D/3D packaging preferred.
• Strong technical background in 2.5D/3D packaging and semiconductor integration schemes (hybrid bonding, interposers, fine-pitch microbumps, TSVs).
• Solid grasp of fab BEoL/MEoL interconnect processing, wafer-level packaging, and advanced assembly flows.
• Understanding of packaging materials, thermo-mechanical reliability, and chip-package interaction failure mechanisms.

Responsibilities

• Develop Advanced Packaging Architectures: Lead the definition, development, and qualification of advanced packaging technologies featuring hybrid bonding, fine-pitch microbumps, interposers, and TSVs.
• Define & Execute Test Vehicles: Design experimental test vehicles, establish packaging design rules, and lead characterization to validate novel interconnect concepts and build confidence for product integration.
• Manage Chip-Package Interaction & Reliability: Assess CPI risks, correlate mechanical and thermal stress behaviors, and partner with failure analysis teams to resolve yield, material, and structural challenges.
• Drive Cross-Functional Co-Optimization: Collaborate across architecture, silicon design, SI/PI, and thermal teams to evaluate holistic system trade-offs across performance, power, reliability, and cost.
• Lead External Technology Partners: Direct foundry and OSAT partners on technology roadmaps, process capability targets, development schedules, and high-volume manufacturing ramp.

Education

BS in Engineering/Related field

PhD in a related field (preferred)

Job description

Apple, Inc. in the San Francisco Bay Area seeks a Packaging Development Engineer to lead 2.5D/3D packaging integration from concept through qualification, collaborating with silicon, SI/PI, thermal and manufacturing teams.

You will define test vehicles, drive reliability, and manage external partners to ramp high-volume manufacturing. The role emphasizes advanced packaging architectures and cross-functional optimization.