Principal Package Engineer - 3D/2.5D High-Speed Packaging

Delos Data Inc

United States

Remote

USD 120,000 - 180,000

Full time

7 days ago

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Job summary

Delos Data Inc. seeks an experienced packaging architect to design and deliver advanced multi-die packages for high-performance accelerator systems. You will guide package selection and interconnects from architecture through bring-up and qualification.

You will coordinate with IC design, physical design, and external foundries/OSATs on bumping, stack-ups, and packaging flows, with emphasis on signal and power integrity.

Qualifications

Experience designing multi-die packages and integrating UCIe.
Understanding substrate materials, stack-ups, and mechanical constraints.
Ability to coordinate with suppliers and external packaging partners.

Responsibilities

Select package approaches (MCM, 2.5D, 3D, fan-out) balancing electrical, thermal, cost, and manufacturability.
Define package specifications, bump and ball maps, interposer needs, and mechanical constraints.
Set substrate stack-ups, pitches, routing, via structures, and material choices.
Design high-speed signal escape and routing, plus package power distribution.
Coordinate subcontractors and engage foundry/OSAT partners on bumping and packaging flows.
Work with IC/PD/SI teams; support bring-up, failure analysis, debugging, and qualification.

Skills

Multi-die packages

UCIe integration

Substrate materials knowledge

Signal & power integrity

Subcontractor management

Foundry/OSAT coordination

Education

Bachelor's or Master's in Electrical Engineering

Tools

HFSS

Sigrity

Job description

You will coordinate with IC design, physical design, and external foundries/OSATs on bumping, stack-ups, and packaging flows, with emphasis on signal and power integrity.

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