AI Packaging Design Lead (Automation & 2.5D/3D)

Advanced Micro Devices, Inc.; Austin (TX); In loco; USD 180.000 - 240.000; Tempo pieno

Descrizione del lavoro

Advanced Micro Devices, Inc. seeks a forward-thinking leader to drive AI-driven workflows for next-generation packaging design automation. You will accelerate substrates, organic interposers, and bridge interconnects with scriptable, scalable solutions.

The role requires bridging physical design and software automation, mentoring engineers, and presenting ROI-focused summaries to executives. A strong background in EDA tools and AI/ML is essential, with a track record in cross-functional

Competenze

• Bachelor's or MS degree in Electrical Engineering, Computer Engineering, Computer Science, or related field with relevant packaging experience.
• Proven leadership and cross-functional collaboration across design, EDA and AI teams.
• Experience bridging physical design requirements and software automation to generate AI-driven workflows.

Mansioni

• Drive the development, deployment, and maintenance of AI workflows for Substrate, Interposer, and Silicon Bridge design methodologies.
• Deploy AI/ML methodologies to optimize critical design stages, including auto-routing, component placement, and signal integrity optimization.
• Collaborate with EDA vendors and internal stakeholders to define and implement next-generation feature roadmaps for 2.5D and 3D packaging.
• Lead the transition from manual design practices to 'Agentic' and algorithmic design operational models.
• Coordinate with electrical and mechanical analysis teams to build closed-loop optimization systems that feed simulation results back into design construction.
• Prepare & present Executive Summaries of automation ROI, efficiency gains, and tool capability advancements.
• Coordination of activities within/external teams to deliver critical design tape-outs and methodology milestones.
• Mentoring junior engineers in coding best practices and advanced packaging concepts.

Conoscenze

Python

Tcl

SKILL

C++

PyTorch

TensorFlow

Formazione

Bachelor's or MS in Electrical Engineering / Computer Engineering / Computer Science

Strumenti

Cadence APD/SIP

Siemens Xpedition

Synopsys 3DIC/Compiler

Descrizione del lavoro

Advanced Micro Devices, Inc. seeks a forward-thinking leader to drive AI-driven workflows for next-generation packaging design automation. You will accelerate substrates, organic interposers, and bridge interconnects with scriptable, scalable solutions.

The role requires bridging physical design and software automation, mentoring engineers, and presenting ROI-focused summaries to executives. A strong background in EDA tools and AI/ML is essential, with a track record in cross-functional