Senior Principal Packaging Engineer - 3D/2.5D Packaging

MACOM; Morgan Hill (CA); Hybrid; USD 161,000 - 228,000; Full time

Benefits offered by this job

RSU eligible

Cash bonuses

Job summary

MACOM is seeking a Senior Principal Packaging Engineer to lead advanced semiconductor packaging efforts. The role focuses on defining architectures, materials, and processes for high-volume production across diverse package types including QFP, QFN, BGA, and 2.5D/3D strategies.

Candidates should have 10+ years in packaging, a strong mechanical/ materials background, and experience with Datacon Evo equipment.

Qualifications

• 10+ years of experience in semiconductor packaging development
• Broad working knowledge of IC package families such as QFP, QFN, BGA, FCBGA, FCCSP, WLCSP, FOWLP, SiP/modules

Responsibilities

• Define package architectures, materials, structures, and assembly process flows meeting reliability, performance, manufacturability and cost
• Develop tooling and processes for high-volume production
• Perform verification and qualification of tooling, machines and materials in development projects
• Coordinate with vendors and internal teams to qualify and debug equipment
• Create and review design & equipment process FMEA
• Provide technical manufacturing support and root-cause analysis
• Contribute to risk assessments and project reviews for executive reporting

Skills

Package development

Semiconductor packaging

IC package families

Advanced packaging

Education

Bachelor's degree in Mechanical Engineering

Tools

Datacon Evo

Job description

MACOM is seeking a Senior Principal Packaging Engineer to lead advanced semiconductor packaging efforts. The role focuses on defining architectures, materials, and processes for high-volume production across diverse package types including QFP, QFN, BGA, and 2.5D/3D strategies.

Candidates should have 10+ years in packaging, a strong mechanical/ materials background, and experience with Datacon Evo equipment.