Lead 2.5D/3D Packaging Architect

Apple, Inc.; Santa Clara (CA); Presencial; USD 150 000 - 225 000; Tempo integral

Vantagens oferecidas por esta oferta de emprego

Employee stock programs

Medical and dental coverage

Relocation assistance

Tuition reimbursement

Resumo da oferta

Apple, Inc. in Santa Clara is seeking an experienced Packaging Development Engineer to drive next-generation 2.5D and 3D packaging integration and technology development for future products.

You will lead architecture exploration through qualification and high-volume manufacturing, collaborating with silicon design, SI/PI, thermal, and manufacturing teams. The role emphasizes advanced packaging architectures, test vehicles, reliability analysis, and external partner leadership, with a focus on

Qualificações

• Bachelor's degree in a technical discipline required.
• Experience with 2.5D/3D packaging and semiconductor integration is preferred.
• Knowledge of BEoL/MEoL interconnect processing is advantageous.
• Ability to balance package-level decisions with silicon, electrical, thermal, and manufacturing constraints.

Responsabilidades

• Develop advanced packaging architectures (2.5D/3D) with hybrid bonding, interposers, microbumps, and TSVs.
• Define and execute experimental test vehicles and packaging design rules for validation.
• Assess CPI risks and resolve reliability concerns with failure analysis teams.
• Collaborate across architecture, silicon design, SI/PI, and thermal teams for system trade-offs.
• Lead external technology partners on roadmaps, process capability, and high-volume manufacturing.

Conhecimentos

2.5D/3D packaging

Hybrid bonding

Interposers

Fine-pitch microbumps

TSVs

CPI risk assessment

Cross-functional collaboration

Manufacturing ramp

Formação académica

Bachelor's degree in a technical discipline

Descrição da oferta de emprego

Apple, Inc. in Santa Clara is seeking an experienced Packaging Development Engineer to drive next-generation 2.5D and 3D packaging integration and technology development for future products.

You will lead architecture exploration through qualification and high-volume manufacturing, collaborating with silicon design, SI/PI, thermal, and manufacturing teams. The role emphasizes advanced packaging architectures, test vehicles, reliability analysis, and external partner leadership, with a focus on