Senior Packaging Engineer — Multi‑Die IC Packages

Entrada Ventures; Palo Alto (CA); Hybrid; USD 180,000 - 240,000; Full time

Benefits offered by this job

Equity

401(k) plan

Benefits package

Job summary

Entrada Ventures seeks a Senior Packaging Engineer to architect and deliver advanced multi-die IC packages for high-performance AI accelerators. The role centers on package architecture, substrate design, manufacturability, and vendor engagement.

You will partner with IC design, physical design, and supplier teams to ensure package requirements satisfy system-level needs and drive adoption of next-generation packaging technologies.

Qualifications

• B.S./M.S. in Electrical Engineering or related field.
• Experience with multi-die package design and UCIe integration.
• Understanding of substrate materials, stack-ups, and mechanical constraints.
• Experience interfacing with TSMC/OSAT for bumping and packaging options.

Responsibilities

• Select and design optimal multi‑die package types (MCM, 2.5D, 3D, fan‑out, CoWoS, InFO, CPC, CPO) balancing electrical performance, thermal behavior, cost, and manufacturability.
• Define package specifications, bump map and ball map, interposer requirements, and mechanical constraints.
• Define substrate stack-ups, bump pitch, ball pitch, routing, via structures, and material choices for performance and manufacturability.
• Perform high-speed signal escaping, routing and power distribution network design.
• Manage subcontractors and work directly with TSMC and/or OSAT on bumping, substrate options, and advanced packaging flows.
• Partner with IC design, physical design, SI/PI, and board teams to ensure package requirements meet system‑level needs.
• Evaluate emerging packaging technologies and drive adoption for next‑generation products.
• Support package‑level bring‑up, failure analysis, debug and qualification.

Skills

Multi-die packaging

UCIe integration

Substrate materials

SI/PI concepts

Subcontractor management

TSMC/OSAT liaison

Package modeling tools

HFSS/Sigrity

Education

B.S./M.S. in Electrical Engineering or related field

Tools

HFSS

Sigrity

Job description

Entrada Ventures seeks a Senior Packaging Engineer to architect and deliver advanced multi-die IC packages for high-performance AI accelerators. The role centers on package architecture, substrate design, manufacturability, and vendor engagement.

You will partner with IC design, physical design, and supplier teams to ensure package requirements satisfy system-level needs and drive adoption of next-generation packaging technologies.