Senior 3D/2.5D Package Layout Engineer for AI Accelerator

DensityAI; Mountain View (CA); On-site; USD 200,000 - 275,000; Full time

Job summary

DensityAI is seeking an experienced package design lead in Mountain View to own the substrate and interposer layout end to end. You will coordinate with architecture, physical design, and OSAT partners to ensure seamless sign-off for high-performance multi-die packages.

Responsibilities include defining stackups, bump mapping, RDL routing, and ensuring DRC/LVS compliance while driving design rule negotiations. AI-assisted tool workflows will accelerate layouts and signoff timelines.

Qualifications

• 8+ years of package layout experience on high-performance designs, including 2.5D/3D and multi-die packages (CoWoS, EMIB, InFO, fan-out, or equivalent interposer technologies).
• Hands-on with industry-standard package layout tools (Cadence Allegro Package Designer / SiP Layout, Siemens Xpedition Package Designer, or equivalent) and package DRC/LVS flows.
• Demonstrated ability to work closely with architecture, physical design, SI/PI, thermo-mechanical, and OSAT partners to converge and sign off complex package designs.
• Exceptional abilities in advanced package physical layout: multi-die substrate and interposer routing, high-density escape, power and ground plane design for high-current accelerator rails, and stackup and via structure definition.

Responsibilities

• Own package substrate and interposer layout end to end; stackup definition, bump and ball map planning, RDL and escape routing, and design release to substrate suppliers and OSATs
• Own die-to-package-to-board co-design, partnering with physical design on bump placement and floorplan and with PCB layout on the package-board interface
• Close package DRC/LVS and netlist verification against OSAT and substrate vendor design rules, and drive rule negotiation where the design requires it
• Use and develop AI assisted tool flows to accelerate package layout, routing, and signoff timelines

Skills

2.5D/3D layout

Interposer routing

High-density routing

Power delivery design

OSAT coordination

Tools

Cadence Allegro

SiP Layout

XPedition Package Designer

Job description

DensityAI is seeking an experienced package design lead in Mountain View to own the substrate and interposer layout end to end. You will coordinate with architecture, physical design, and OSAT partners to ensure seamless sign-off for high-performance multi-die packages.

Responsibilities include defining stackups, bump mapping, RDL routing, and ensuring DRC/LVS compliance while driving design rule negotiations. AI-assisted tool workflows will accelerate layouts and signoff timelines.