Senior Packaging Architect for 2.5D/3D AI Hardware

Platform Recruitment; Austin (TX); On-site; USD 300,000 - 400,000; Full time

Benefits offered by this job

Meaningful equity

Stock options

Annual local bonus

Strategic packaging direction

Build packaging team

Job summary

Platform Recruitment is seeking a senior Packaging Architect for an ambitious AI hardware company in Austin, TX. The role owns advanced semiconductor packaging strategy, architecture, and the long‑term technology roadmap, with cross‑functional impact and team-building responsibility.

The ideal candidate brings 10+ years in advanced packaging, deep ASIC-to-substrate expertise, and hands‑on experience with 2.5D/3D architectures.

Qualifications

• 10+ years' experience in advanced semiconductor packaging for ASICs or high-performance products.
• Ownership of package architecture, technology strategy or roadmap development.
• Deep expertise in ASIC-to-substrate integration and package design.
• Hands-on with 2.5D/3D packaging, multi-die integration and heterogeneous architectures.

Responsibilities

• Own ASIC-to-substrate package architecture, including bump mapping and floorplanning.
• Lead package design from concept through layout, simulation, verification, sign-off and release.
• Develop future 2.5D/3D architectures, including multi-die integration.
• Lead package-level SI/PI analysis and translate results into design improvements.
• Drive package-to-board co-design, aligning silicon, substrate, PCB and system requirements.
• Establish packaging design methodologies, libraries, tool flows and engineering processes.
• Build relationships with substrate vendors, OSATs, foundries and external manufacturing partners.
• Lead DFM, qualification, reliability and productisation activities.
• Help build and lead a packaging engineering team while remaining technically hands‑on

Skills

Semiconductor packaging

Package architecture ownership

2.5D/3D packaging

SI/PI simulation

Cross-functional leadership

Roadmap development

Wafer-level packaging exposure

Tools

Cadence Allegro X APD

Siemens Xpedition

Ansys SIwave

Cadence Sigrity

Job description

Platform Recruitment is seeking a senior Packaging Architect for an ambitious AI hardware company in Austin, TX. The role owns advanced semiconductor packaging strategy, architecture, and the long‑term technology roadmap, with cross‑functional impact and team-building responsibility.

The ideal candidate brings 10+ years in advanced packaging, deep ASIC-to-substrate expertise, and hands‑on experience with 2.5D/3D architectures.