Senior Mechanical Modeling Architect — Advanced Packaging

AMD; Austin (TX); On-site; USD 180,000 - 240,000; Full time

Job summary

AMD is seeking a Package-centric Mechanical Modeling Architect in Austin, TX. You will define and drive next-generation packaging-platform architectures, using rigorous model-based decisions to guide electro-thermal and electro-optical integration across package, board and cooling solutions.

The ideal candidate leads with autonomy, collaborates across silicon, package, thermal, optical, and system teams, and influences product roadmaps for data center HPC systems.

Qualifications

• Demonstrated experience owning model-based architecture & design decisions across board-, package-, and system-level mechanical modeling.
• Strong background in advanced PCB technologies, high-layer-count designs, warpage and stiffness control.
• Solid foundation in Mechanics, Fracture, Materials, Design & FEA with first-principles multi-physics applications.
• Experience guiding SMT processes, connectors, and mechanical assembly strategies.
• Experience integrating electro-thermal and electro-optical technologies at board/package level.
• Proven track record influencing experimental test plans and correlating simulations with data.

Responsibilities

• Drive model-based architecture and design decisions for development and qualification of advanced package technologies.
• Develop and maintain mechanical and multi-physics models and drive validation strategies for STCO.
• Collaborate with manufacturing to define and optimize SMT and assembly processes.
• Engage with PCB suppliers and vendors to align materials and modeling assumptions with needs.
• Define targets and strategic direction for mechanical and package technology development.
• Serve as a SME for mechanical & multi-physics in data center platforms.

Skills

Model-based design

Mechanical modeling

Multi-physics modeling

FEA/structural analysis

DOE/test correlation

AI/ML in engineering

Education

MS/PhD in Engineering or Physics

Tools

FEA software

Job description

AMD is seeking a Package-centric Mechanical Modeling Architect in Austin, TX. You will define and drive next-generation packaging-platform architectures, using rigorous model-based decisions to guide electro-thermal and electro-optical integration across package, board and cooling solutions.

The ideal candidate leads with autonomy, collaborates across silicon, package, thermal, optical, and system teams, and influences product roadmaps for data center HPC systems.