Packaging Architect

Platform Recruitment; Austin (TX); On-site; USD 300,000 - 400,000; Full time

Benefits offered by this job

Meaningful equity

Stock options

Annual local bonus

Strategic packaging direction

Build packaging team

Job summary

Platform Recruitment is seeking a senior Packaging Architect for an ambitious AI hardware company in Austin, TX. The role owns advanced semiconductor packaging strategy, architecture, and the long‑term technology roadmap, with cross‑functional impact and team-building responsibility.

The ideal candidate brings 10+ years in advanced packaging, deep ASIC-to-substrate expertise, and hands‑on experience with 2.5D/3D architectures.

Qualifications

• 10+ years' experience in advanced semiconductor packaging for ASICs or high-performance products.
• Ownership of package architecture, technology strategy or roadmap development.
• Deep expertise in ASIC-to-substrate integration and package design.
• Hands-on with 2.5D/3D packaging, multi-die integration and heterogeneous architectures.

Responsibilities

• Own ASIC-to-substrate package architecture, including bump mapping and floorplanning.
• Lead package design from concept through layout, simulation, verification, sign-off and release.
• Develop future 2.5D/3D architectures, including multi-die integration.
• Lead package-level SI/PI analysis and translate results into design improvements.
• Drive package-to-board co-design, aligning silicon, substrate, PCB and system requirements.
• Establish packaging design methodologies, libraries, tool flows and engineering processes.
• Build relationships with substrate vendors, OSATs, foundries and external manufacturing partners.
• Lead DFM, qualification, reliability and productisation activities.
• Help build and lead a packaging engineering team while remaining technically hands‑on

Skills

Semiconductor packaging

Package architecture ownership

2.5D/3D packaging

SI/PI simulation

Cross-functional leadership

Roadmap development

Wafer-level packaging exposure

Tools

Cadence Allegro X APD

Siemens Xpedition

Ansys SIwave

Cadence Sigrity

Job description

My client, an ambitious AI hardware company developing next-generation accelerators, is looking for a Packaging Architect to own its advanced semiconductor packaging strategy and architecture. This is a senior, hands‑on role combining package design and simulation with long‑term technology roadmap ownership, cross‑functional collaboration and the opportunity to build a packaging engineering team.

Key Responsibilities

• Own ASIC-to-substrate package architecture, including bump mapping, substrate routing, floorplanning and stack-up definition
• Lead package design from concept through layout, simulation, verification, sign-off and manufacturing release
• Develop future 2.5D/3D architectures, including multi-die, chiplet and heterogeneous integration
• Lead package-level signal integrity and power integrity analysis, translating results into design improvements
• Drive package-to-board co-design, aligning silicon, substrate, PCB and system requirements
• Establish packaging design methodologies, libraries, tool flows and engineering processes
• Build relationships with substrate vendors, OSATs, foundries and external manufacturing partners
• Lead DFM, qualification, reliability and productisation activities
• Help build and lead a packaging engineering team while remaining technically hands‑on

Requirements

• 10+ years' experience in advanced semiconductor packaging for ASICs or high-performance products
• Proven ownership of package architecture, technology strategy or roadmap development
• Deep expertise in ASIC-to-substrate integration and package design
• Strong experience with 2.5D and/or 3D packaging, multi-die integration and heterogeneous architectures
• Hands‑on experience with Cadence Allegro X APD, Siemens Xpedition or equivalent tools
• Strong package-level SI/PI simulation skills using Ansys SIwave, Cadence Sigrity or equivalent
• Experience across package layout, verification, release and package-to-board integration
• Experience establishing packaging capabilities, processes or teams
• Strong relationships with substrate vendors, OSATs and foundries
• Experience with AI accelerators, HPC, networking or data‑centre hardware
• Exposure to wafer-level packaging and emerging advanced packaging technologies
• Experience with optical or photonic integration
• Knowledge of package reliability, qualification and failure analysis
• Experience taking advanced packaging technologies into production

What’s on Offer

• $300,000–$400,000 base salary, depending on experience
• Meaningful equity and stock options
• Annual living-local bonus for employees living within 20 minutes of the office
• Strategic ownership of packaging architecture and future technology direction
• Opportunity to build a packaging function and team from the ground up
• Work on next-generation AI accelerator technology at the forefront of hardware innovation