Senior 2.5D/3D Packaging Architect for HPC & Auto

MediaTek; San Jose (CA); On-site; USD 171,000 - 272,000; Full time

Benefits offered by this job

Comprehensive health insurance

401(k) plan

Paid holidays and leave

Job summary

MediaTek Research Lab Inc. in San Jose is looking for an experienced Packaging Architect specializing in advanced semiconductor packaging technologies like 2.5D/3D/3.5D. This position involves collaboration with various teams to develop innovative packaging solutions for automotive and computing applications.

The ideal candidate should possess over eight years of hands-on experience and excellent communication skills. Competitive salary range is $171,000 to $272,000, plus benefits including health insurance and a 401(k).

Qualifications

• 8+ years in advanced semiconductor package architecture.
• Hands-on experience with 2D, 2.5D, and 3D packaging.
• Strong understanding of high-speed interface impact on packaging.

Responsibilities

• Identify optimal package architecture balancing performance.
• Collaborate on silicon-disaggregation and chiplet strategies.
• Perform trade-off analysis impacting product metrics.
• Define packaging technology and material requirements.
• Engage with product team and customers on emerging architectures.

Skills

Advanced semiconductor package architecture (2.5D/3D/3.5D)

Power-signal integrity

Thermal-mechanical engineering

High-speed interfaces (SERDES, PCIe)

Communication skills

Tools

EDA tools

CAD tools

Job description

MediaTek Research Lab Inc. in San Jose is looking for an experienced Packaging Architect specializing in advanced semiconductor packaging technologies like 2.5D/3D/3.5D. This position involves collaboration with various teams to develop innovative packaging solutions for automotive and computing applications.

The ideal candidate should possess over eight years of hands-on experience and excellent communication skills. Competitive salary range is $171,000 to $272,000, plus benefits including health insurance and a 401(k).