Panel-Scale Packaging Director for AI Data Centers

Advanced Micro Devices, Inc.; Austin (TX); On-site; USD 180,000 - 260,000; Full time

Job summary

AMD Austin is seeking an advanced packaging technology leader to drive panel-scale packaging for data center and AI accelerator products. You will own technology direction, coordinating with foundries, OSATs, substrates, materials, and equipment partners to deliver materials, processes, design rules, and DFx guidelines from concept to high-volume manufacturing.

You will lead cross-functional teams across geographies, communicate progress to executive leadership, and drive risk mitigation and

Qualifications

• Proven track record in semiconductor tech development with external partners.
• Experience in panel-scale packaging or 2.5D/3D packaging.
• Strong communication and leadership without direct authority.

Responsibilities

• Define the panel-scale packaging technology roadmap for data center and AI products and align partner roadmaps.
• Lead panel-scale development with partners—from concept through full qualification.
• Set technical requirements and guide materials selection and process definition.
• Establish design rules and DFM/DFY guidelines with test vehicles.
• Drive partner equipment and infrastructure readiness for panel-format manufacturing.
• Resolve large-panel challenges including warpage and overlay.
• Lead cross-functional teams and provide executive updates on progress and risks.

Education

BS/MS/PhD in engineering

Job description

AMD Austin is seeking an advanced packaging technology leader to drive panel-scale packaging for data center and AI accelerator products. You will own technology direction, coordinating with foundries, OSATs, substrates, materials, and equipment partners to deliver materials, processes, design rules, and DFx guidelines from concept to high-volume manufacturing.

You will lead cross-functional teams across geographies, communicate progress to executive leadership, and drive risk mitigation and