Senior Package SI/PI Engineer - High-Speed Memory Systems

Qualcomm; San Diego, Northern (CA, KY); Hybrid; USD 202,000 - 302,000; Full time

Job summary

Qualcomm Technologies, Inc. seeks a Package System Design and Technology Engineer to drive advanced package tech development, from concept design through multi-physics simulation and lab validation, enabling high-performance, low-cost systems.

You will collaborate with internal/external teams, perform signal and power integrity analyses, and interface with board, package, and IC designers to optimize overall package designs for high-speed memory interfaces.

Qualifications

• DDR in Package/PCB/System Design experience.
• Electromagnetics background with transmission line theory and crosstalk.
• Matlab to automate simulation flow; programming in C/C++ or scripting in Python/Perl is a plus.

Responsibilities

• Perform IO analyses and model extraction from simulation to reporting.
• Analyze IO power distribution in product development and reference systems.
• Perform package extraction for time-domain and frequency-domain analysis and provide design guidelines.

Job description

Qualcomm Technologies, Inc. seeks a Package System Design and Technology Engineer to drive advanced package tech development, from concept design through multi-physics simulation and lab validation, enabling high-performance, low-cost systems.

You will collaborate with internal/external teams, perform signal and power integrity analyses, and interface with board, package, and IC designers to optimize overall package designs for high-speed memory interfaces.