Senior Package SI/PI Engineer for High-Speed Interfaces

Nutanix; San Diego (CA); On-site; USD 202,000 - 302,000; Full time

Job summary

Qualcomm Technologies, Inc. seeks a Package System Design and Technology Engineer to drive advanced package technology development, design architecture analysis, and multi-physics validation from package to system.

You will perform electrical model extraction and high-speed memory interface simulations, interfacing with board, package, and IC designers. Responsibilities include IO analyses, package extraction, and producing design guidelines with thorough documentation.

Qualifications

• Bachelor's degree and 8+ years in System/Package Design or related work.
• Master’s degree with 7+ years or PhD with 6+ years is acceptable.
• Experience with DDR/LPDDR and package-to-system integration.

Responsibilities

• Perform IO analyses using established methods from model extraction to simulation.
• Analyze IO power distribution in product development and reference systems.
• Perform package extraction for time/frequency domain analysis and provide design guidelines.
• Create clear, complete documentation of results and present findings.

Skills

DDR/I/O analysis

Electromagnetics

Field solvers

IBIS/IBIS AMI

SPICE simulations

Matlab automation

C/C++ / Python

Transmission line theory

Education

Bachelor's degree in Chemical/Electrical/Mechanical Eng or related

Master's degree

PhD

Tools

HFSS

Q3D

Sentinel-PSI

Clarity

ADS

HSPICE

Job description

Qualcomm Technologies, Inc. seeks a Package System Design and Technology Engineer to drive advanced package technology development, design architecture analysis, and multi-physics validation from package to system.

You will perform electrical model extraction and high-speed memory interface simulations, interfacing with board, package, and IC designers. Responsibilities include IO analyses, package extraction, and producing design guidelines with thorough documentation.