Principal Engineer, Signal and Power Integrity

Socket.dev; San Diego (CA); On-site; USD 202,000 - 302,000; Full time

Job summary

Qualcomm seeks a Package System Design and Technology Engineer to drive advanced package technology development and architecture analysis from package to system. You will perform multi-physics simulations, lab validation, and manufacturing qualification for new product introduction, interfacing with IP teams and vendors to set specifications.

You will collaborate with cross-disciplinary teams to optimize mechanical, electrical, and thermal package systems for high performance and reliability,

Qualifications

• Bachelor's or higher in an engineering field with extensive system/package design experience.
• Experience with DDR in package/PCB/system design for compute/server standards.
• Proven experience in electromagnetics and transmission line theory.

Responsibilities

• Drive IO analyses from model extraction to simulation and reporting.
• Analyze IO power distribution in product development and reference systems.
• Perform package extraction for time/frequency domain analysis and provide design guidelines.
• Document results clearly and completely.

Skills

DDR/Package Design

Electromagnetics

HFSS

Q3D

Sentinel-PSI

Clarity

SPICE ADS/Hspice

IBIS/AMI models

Matlab automation

C/C++ or Python

Education

Master's or PhD (3+/- years)

PhD in Engineering field

Tools

NDAs not listed

Job description

Company:

Job Area:

General Summary:

As a Qualcomm Package System Design and Technology Engineer, you will drive new advanced package technology development, concept design architecture analysis from package to system, new generation product package structure selection, package system design by multi-physics simulation analysis, multi-physics lab validation/correlation of package to system models, and the manufacturing qualification for new product introduction (NPI). Package System Design and Technology Engineers collaborate with multi-disciplinary teams to achieve optimized performance of mechanical, electrical, and thermal package systems for various end market applications. This role interfaces with internal/external IP teams, industry standards, and vendors to set package to system design and technology specifications; enabling product designs to achieve high performance, high reliability, low cost, and easy to implement system with integrated component attaches for end customers.

The candidate will work in a team-oriented, professional engineering environment to perform a variety of signal and power integrity tasks and collaborate with package and IC designers to optimize the overall package design. Electrical model extraction and signal and power integrity simulations will constitute the majority of the tasks. This engineer must interface with a variety of board, package, and IC designers. Working effectively across organizational boundaries is essential, as is effective documentation and presentation of results. This candidate will work on high-speed memory interfaces for electrical model extraction and system-level simulation.

Responsibilities:

• Perform various IO analyses using established methodologies, potentially from model extraction through simulation and reporting of conclusions. IO types include a variety of memory interfaces.
• Apply established methodologies to analyze IO power distribution in product development and reference systems.
• Perform package extraction for time domain and frequency domain analysis and provide design guidelines for the package design.
• Create clear and complete documentation of results.

Preferred Qualifications:

• 8+ years of experience in DDR in Package/PCB/System Design related to compute/server standards.
• Experience in electromagnetics and a solid background in transmission line theory and crosstalk.
• Proficiency in field solvers such as HFSS, Q3D, Sentinel-PSI, and Clarity, and SPICE transient simulation (ADS, Hspice), including use of IBIS and IBIS AMI models.
• Experience in DDR design specifications such as DDR and LPDDR
• Experience in Matlab to automate existing simulation flow.
• Experience in programming languages (C/C++) or scripting languages (Perl/Python) is a plus.
• Master’s or Ph.D. degree with 3+ years of industry experience.

Minimum Qualifications:

• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 8+ years of System/Package Design/Technology Engineering or related work experience.
• Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 7+ years of System/Package Design/Technology Engineering or related work experience.
• PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ year of System/Package Design/Technology Engineering or related work experience.

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail [e-mail] or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

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EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

Pay range and Other Compensation & Benefits:

$201,600.00 - $302,400.00

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.

If you would like more information about this role, please contact Qualcomm Careers.