Senior Package Architect: Advanced Packaging & System Exploration

Micron Technology; San Jose (CA); On-site; USD 177,000 - 387,000; Full time

Job summary

Micron Technology is seeking an experienced professional for a role focused on advanced package architectures and package-level simulation in San Jose, California. The ideal candidate will possess at least a Bachelor’s degree and 10+ years of experience in package design. Responsibilities include defining package architectures, running thermal simulations, and guiding architectural requirements. The position offers a competitive salary range from $177,000 to $387,000 annually.

Qualifications

• 10+ years of hands-on experience in package design or package-level simulation.
• Strong experience with package SI modeling and analysis.
• Ability to independently build models and drive conclusions.

Responsibilities

• Define and explore advanced package architectures for future memory systems.
• Perform package-level trade-off studies across SI, PI, thermals, cost, and scalability.
• Create hands-on package designs and models for early feasibility analysis.

Skills

Package design

Package-level simulation

SI modeling and analysis

Thermal simulations

Education

Bachelor’s degree in EE, ME, Materials, or related field

Master’s degree in a related technical field

Job description

Micron Technology is seeking an experienced professional for a role focused on advanced package architectures and package-level simulation in San Jose, California. The ideal candidate will possess at least a Bachelor’s degree and 10+ years of experience in package design. Responsibilities include defining package architectures, running thermal simulations, and guiding architectural requirements. The position offers a competitive salary range from $177,000 to $387,000 annually.