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TSMC is seeking a highly skilled Substrate / Advanced Package Engineer to join our 3DIC design team in San Jose, CA. The role involves design, simulation, and modeling of complex substrate and packaging technologies. Ideal candidates will have a Master’s or Ph.D. and 15+ years of experience in semiconductor physics and advanced packaging technologies.
With responsibilities including optimization and collaboration across teams, this position offers a competitive salary ranging from $153,500 to $250,000 annually, alongside comprehensive benefits and career development opportunities.
TSMC is seeking a highly skilled Substrate / Advanced Package Engineer to join our 3DIC design team in San Jose, CA. The role involves design, simulation, and modeling of complex substrate and packaging technologies. Ideal candidates will have a Master’s or Ph.D. and 15+ years of experience in semiconductor physics and advanced packaging technologies.
With responsibilities including optimization and collaboration across teams, this position offers a competitive salary ranging from $153,500 to $250,000 annually, alongside comprehensive benefits and career development opportunities.