Package Architect — Advanced Packaging & System Exploration

1000 Micron Technology, Inc.; Boise (ID); On-site; USD 177,000 - 387,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid family leave

Paid time-off program

Job summary

1000 Micron Technology, Inc. in Boise, ID is seeking an experienced engineer to define and explore advanced package architectures for next-gen memory systems. You will perform critical trade-off studies, create hands-on package designs, and run simulations for SI/PI and thermal analysis.

The ideal candidate has over 10 years of experience in package design with a Bachelor’s degree in Engineering. The position offers a competitive salary range of $177,000 - $387,000, along with comprehensive benefits that include medical, dental, vision plans, and paid time-off.

Qualifications

• 10+ years of hands-on experience in package design or package-level simulation.
• Ability to independently build models and drive conclusions.

Responsibilities

• Define and explore advanced package architectures for future memory systems.
• Perform package-level trade-off studies across SI, PI, thermals, cost, and scalability.
• Run SI/PI and thermal simulations and translate results into architecture guidance.

Skills

Package design expertise

SI modeling and analysis

Thermal simulation

Education

Bachelor’s degree in EE, ME, Materials, or related field

Master’s degree in a related technical field

Job description

1000 Micron Technology, Inc. in Boise, ID is seeking an experienced engineer to define and explore advanced package architectures for next-gen memory systems. You will perform critical trade-off studies, create hands-on package designs, and run simulations for SI/PI and thermal analysis.

The ideal candidate has over 10 years of experience in package design with a Bachelor’s degree in Engineering. The position offers a competitive salary range of $177,000 - $387,000, along with comprehensive benefits that include medical, dental, vision plans, and paid time-off.